Sumitomo Seika Chemicals Co., Ltd.

Noriaki Fukuda

Katsumasa Yamamoto

Ryota Harisaki

Shohei Sanada

Yuhei Funabiki

Nobukatsu Nemoto

Kairi Kakutaka

Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

Epoxy resin composition

There is provided an epoxy resin composition having excellent adhesion to copper and aluminum, and having excellent flexibility in a low-temperature environment. The epoxy resin composition comprises (A) an epoxy resin and (B) a polyamide-based rubber elastomer powder.

Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.

Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.

Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.

The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): wherein Y is a bond, a Calkylene group, etc.; Ris the same or different, and is a Calkyl group, etc., Ris the same or different, and is a Calkylene group, etc., Ris the same or different, and is a Calkyl group, etc., and n is the same or different, and is an integer of 0 to 3. The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.

Epoxy resin composition, process for producing same, and uses of said composition

The present invention aims to provide a condensation-curable silicone resin composition with excellent adhesion properties. The present invention also aims to provide a condensation-curable silicone resin cured product formed from the condensation-curable silicone resin composition and a sealed optical semiconductor element formed by using the condensation-curable silicone resin composition. The present invention is a condensation-curable silicone resin composition including: a condensation-curable silicone resin mixture; and an adhesion-imparting agent, the adhesion-imparting agent including a compound that includes at least one group A, wherein the group A is represented by the formula wherein Rrepresents a C1-C8 alkylene group in which a carbon atom other than a carbon atom bonded to a silicon atom is optionally partially substituted with an oxygen atom; R's each independently represent a C1-C3 alkylene group; R's each independently represent a C1-C3 alkylene group; R's each independently represent a hydrogen atom, a C1-C3 alkyl group, an OH group-containing C1-C3 alkyl group, or a halogen group; and x is an integer of 0 to 2.

Condensation-curable silicone resin composition, condensation-curable silicone resin cured product, and sealed optical semiconductor element

The invention aims to provide an addition curable silicone resin composition with excellent interfacial adhesion properties, storage stability and transparency. The addition curable silicone resin mixtures has a refractive index of 1.35 to 1.45 and includes a silicone compound having at least one group of the following formula: 

Addition-curable silicone resin composition, addition-curable silicone resin cured product, and sealed optical semiconductor element

The present invention provides a silicone resin composition having excellent adhesion. The present invention also aims to provide a cured silicone resin and a sealed optical semiconductor element each produced using the silicone resin composition. The present invention relates to a silicon resin composition comprising: a silicon resin mixture; and (B) a silicon compound, the silicon resin mixture containing (A-i) polyorganosiloxane that has at least two substituents each having a carbon-carbon double bond bonded to a silicon atom, (A-ii) polyorganohydrogen siloxane having at least two hydrogen groups each bonded to a silicon atom, and (A-iii) a hydrosilylation catalyst, the (B) silicone compound having a structural unit represented by Formula (1-3) and a structural unit represented by Formula (1-4) between a structural unit represented by Formula (1-1) and a structural unit represented by Formula (1-2): in Formula (1-1) and Formula (1-2), Rs each independently representing a C1-C18 hydrocarbon group selected from an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl group, in Formula (1-3) and Formula (1-4), Rs each independently representing a C1-C18 hydrocarbon group selected from an alkyl group, a cycloalkyl group, an aryl group, and an aralkyl group, in Formula (1-3), Rrepresenting a C1-C8 alkylene group in which a part of carbon atoms, except for the carbon atom bonded to a silicon atom, is optionally substituted with an oxygen atom, Rrepresenting a C1-C3 alkylene group, Rrepresenting a C1-C3 alkylene group, Rrepresenting a hydrogen atom, a C1-C3 alkyl group, a C1-C3 alkyl group having an OH group, or a halogeno group, in Formula (1-3), m representing an integer of 1 to 50, x representing an integer of 0 to 2, and in Formula (1-4), n representing an integer of 10 to 1500.

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Kako-gun, Japan

Noriaki Fukuda