Toyo Boseki Kabushiki Kaisha

Other

Aisin Seiki Kabushiki Kaisha

Nori Yoshihara

Akira Taniguchi

Satoshi Kosugi

Koji Nakanishi

Junji Koizumi

Hidehiro Nakamura

Yutaka Ogasawara

Kiyotaka Nakai

Shigeo Kobayashi

Masahiro Ogata

Minoru Hayashi

Satoshi Sakai

Kenji Ohama

Satoru Watanabe

Koji Kinoshita

Kiyoji Nanbu

Yukio Goto

Hitoshi Kosugi

Kenjiro Ogami

Yukio Gotoh

The present invention provides a resin composition for a slide fastener. In one embodiment, upon setting, the resin composition does not melt even upon contact with a hot surface. In addition, the fastener provides low sliding resistance or friction, as well as durability and structural strength to withstand repeated opening and closing operations. Finally, the fastener can be dyed with cloth in the same bath.

Slide fastener

The present invention provides a polyester resin composition for engine peripheral parts, the resin composition comprising at least one polymer selected from the group consisting of polyethylene terephthalate and an ethylene terephthalate copolymer; an inorganic reinforcement material; and an olefin polymer, wherein a molded article produced from the resin composition has a flexural strain at break of 3.5% or higher and a deflection temperature under load of 180&deg; C. or higher.

Polyester resin composition for engine peripheral parts

The present invention relates to an adhesive resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic, the thermoplastic resin (B) having a melting point ranging from 90&deg; C. to 200&deg; C. The present invention also relates to a method for separating a bonded article into adherends, the method comprising detaching by induction heating the bonded portions of adherends bonded together by the thermoplastic resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic substance and has a melting point ranging from 90&deg; C. to 200&deg; C.

Adhesive resin composition and method for separating adherends bonded together by the composition

A resin composition for high-frequency bonding with a dielectric loss tangent of 0.03 or higher at a frequency of 40 MHz, containing a thermoplastic resin having a melting point of 80&deg; C. to 200&deg; C. in an amount of 70% to 99% by volume, based on the total volume of the composition, and a conductive material having a volume resistivity of 10 &OHgr;.cm or lower in an amount of 30% to 1% by volume, based on the total volume of the composition.

Resin composition for high-frequency bonding

A light-reflecting molded article is constituted of a molded article made from a polyester resin composition and a light-reflecting metal layer formed on the molded article. The light-reflecting molded article has an average surface roughness of at most 0.3 &mgr;m and a deflection temperature under load of at least 160&deg; C. The polyester resin composition includes 100 parts by weight of polybutylene terephthalate resin and 1 to 100 parts by weight of polyalkylene naphthalate resin.

Polyester resin composition and light-reflecting molded article thereof

There is disclosed a polyamide resin composition containing: (A) 85 to 95 parts by weight of a polyamide resin; (B) 5 to 15 parts by weight of wollastonite; (C) 3 to 10 parts by weight, to 100 parts by the total weight of ingredients (A) and (B), of a styrene copolymer modified with at least one modifier selected from the group consisting of unsaturated carboxylic acids and unsaturated dicarboxylic anhydrides; and (D) 0.5 to 5 parts by weight, to 100 parts by the total weight of ingredients (A) and (B), of a high-density polyethylene modified with at least one modifier selected from the group consisting of unsaturated carboxylic acids and unsaturated dicarboxylic anhydrides, the high-density polyethylene having a weight-average molecular weight of 50,000 to 400,000.

Polyamide resin composition

There is disclosed a polyester resin composition comprising: (a) 50 to 70 parts by weight of a polyester resin composed mainly of a repeating unit of butylene terephthalate; (b) 30 to 50 parts by weight of a polyester resin composed mainly of a repeating unit of ethylene terephthalate; (c) 0.1 to 10 parts by weight of a polyalkylene glycol derivative having at least one end group of carboxylate and alkyl ether, per 100 parts by the total weight of the polyester resins (a) and (b); and if necessary or required, (d) not more than 120 parts by weight of an inorganic reinforcing agent, per 100 parts by the total weight of the polyester resins (a) and (b).

Polyester resin composition comprising butylene terephthalate, ethylene

Polyester composition

The present application provides a polyester composition composed of polyethylene terephthalate or a polyester containing at least 80 mol % of ethylene terephthalate repeating units and 0.1 to 15 weight %, based on the polyester, of an organic crystallization promoting agent having a polyoxyalkylene chain and at least one epoxy group. The latter promoting agents are represented by such materials as a glycidyl ether of a polyalkylene glycol having a molecular weight less than 5000. Such crystallization promoting agents serve to prevent streaks and pock marks on the surface of articles molded from such polyester compositions.

Growing community of inventors

Otsu, Japan

Nori Yoshihara