Alcatel

Norbert Venet

St&eacute;phane Albinet

Olivier Vendier

Claude Drevon

Marc Huan

Jean-Cyril Esther

Philippe Calvel

A method of obtaining a module including at least one inductive winding made up of one or more conductive tracks on a printed circuit film support on which the tracks form turns which are combined to form a winding or a plurality of parallel and/or coaxial windings. The method includes the steps of: stacking a plurality of aligned modular printed circuit film elements carrying a set of turns which are intended to form part of a winding or of a plurality of parallel and/or coaxial windings and whose tracks terminate at or near the edge or one edge of the element that includes them, molding an insulative material over the stacked assembly of modular elements to constitute a rigid block, cutting the molded block laterally along the stack to expose the conductive tracks at a common alignment level and so that they are flush with the surface of one face of the block, which cutting step is performed at least once, and creating connections on the face or faces of the block with which the modular conductive track elements are flush to interconnect them selectively and to connect them to connection means external to the module.

Method of obtaining a module including an inductive winding

A method of obtaining a module ( ), and the module obtained, from modular electronic components encapsulated in flat monoblock packages ( A) in which elements constituting the components are buried and from which project laterally conductive connecting leads ( A), the packages being stacked and buried in an insulative block corresponding to at least one module and the projecting connecting leads of the stacked packages being flush with a surface of the block, on at least one face of said block on which are formed conductive interconnection tracks and/or contacts for connecting the leads with connecting means external to the module. The method includes, before stacking the packages, an operation of modifying the connecting leads of the packages in order to reduce their overall size and an operation of reducing the height of the packages by thinning their respective bases.

Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby

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La Salvetat St Gilles, France

Norbert Venet