Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Norbert Sickmann

Thomas Buschhardt

Rainer Neumann

Manfred Thurner

Paul Muller

Franz Mangs

Heinrich Hennhofer

Klaus Rottger

A method is for the polishing of semiconductor wafers, which are mounted on a front side of a support plate and one side face of which is pressed anst a polishing plate, which is covered with a polishing cloth, with a specific polishing pressure and polished. A device is provided which is suitable for carrying out the method. The method includes a) applying a specific pressure to at least one of a plurality of pressure chambers prior to the polishing of the semiconductor wafers, and b) during the polishing of the semiconductor wafers, transmitting the polishing pressure to a rear side of the support plate via elastic bearing surfaces of the pressure chambers to which pressure has been applied.

Method and device for polishing semiconductor wafers

Growing community of inventors

Burghausen, Germany

Norbert Sickmann