Cisco Technology, Inc.

Norbert Schlepple

Vipulkumar K Patel

Jock T Bovington

Weizhuo Li

Aparna R Prasad

Mary Nadeau

Jean-Luc Joseph Tambasco

Mittu Pannala

Jarrett S Neiman

Anthony D Kopinetz

Paul Ton

Neda Noble

Arturo Pachon Munoz

In a first embodiment aspect presented in this disclosure, an optical wafer-level (OWL) package includes a frontside electrical redistribution layer (RDL) and a molding compound layer, the OWL package further including at least one of (1) an optical transmitter at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical transmitter arranged for providing an optically modulated output data signal; or (2) an optical receiver at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical receiver arranged for receiving an optically modulated input data signal.

Optical wafer-level package

The fiber array units (FAUs) described herein include an FAU substrate with a coupling surface, an array of V-grooves formed in a FAU substrate, and a plurality of optical channels individually disposed in a respective V-groove of the array of V-grooves. The array of V-grooves and the optical channels are configured to position the optical channels along a curve defined in the coupling surface such that the optical channels are aligned with waveguides in a warped photonic device.

Fiber array unit for flexible optical coupling

An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silicon vias (TSVs) and positioned on the EMC layer. A combined thickness of the EMC layer and the silicon interposer layer provide a combined mechanical coupling thickness for a connection component on a smooth diced edge side of the EMC layer and the silicon interposer layer. The optical package also includes devices attached to the silicon interposer layer.

Optical packaging features for mechanical stability and optical fiber coupling

The optical devices described herein include a lens arrangement for coupling light between light sources and optical fibers with a reduced size compared to the use of optical waveguides, while also allowing for the use of power sensitive optical components, such as components with lower power density configurations. The lens arrangements include a collimating lens, a focusing lens, and at least one optical component positioned between the collimating lens and the focusing lens.

Dual lens optical coupling to multicore fiber

Heatsinking in laser devices may be improved via a device, including: a header disk having a first face with a circumference; a header post that is thermally conductive, and having: a second face connected to the first face coterminously with the circumference; a third face opposite to the second face; and a fourth face perpendicular to the second face and the third face; a lens holder, having a fifth face connected to the third face; and an optical subassembly connected to the fourth face and optically aligned with the lens holder. The device may also be understood to comprise: a header disk having a circumference; a header post that is thermally conductive, the header post having: an arc coterminous to a portion of the circumference; a mounting face, perpendicular to a plane in which the arc and the circumference are defined; and a bonding face perpendicular to the mounting face.

Heatsinking in laser devices

Techniques are provided for radiation-induced birefringence in a Polarization-Maintaining Fiber (PMF). In one example, a fiber is obtained. At least one local volume of the fiber is irradiated to induce an end-to-end birefringence in the fiber. Based on the end-to-end birefringence induced in the fiber, a PMF is produced.

Radiation-induced birefringence in Polarization-Maintaining Fiber

An apparatus includes a ribbon, an optical waveguide, and an IC. The ribbon includes a first end. The optical waveguide is disposed within the ribbon and terminates at the first end. The IC includes a curved surface. The first end of the ribbon bends to mate with the curved surface such that the optical waveguide is optically coupled to a corresponding waveguide in the IC.

Opto-electrical flexible glass interposer

Aspects described herein include a method of fabricating an optical component, the optical component, and a method of operating the optical component. A method includes electrically coupling a first laser channel and a second laser channel of a laser die to different electrical leads and testing (i) a first optical coupling of the first laser channel and a second optical coupling of the second laser channel or (ii) a first spectral performance of the first laser channel and a second spectral performance of the second laser channel. The method also includes optically aligning an optical fiber with the first laser channel and designating the second laser channel as a heater element for the first laser channel based at least in part on (i) the first optical coupling being greater than the second optical coupling or (ii) the first spectral performance relative to the second spectral performance.

Package self-heating using multi-channel laser

A system includes an optical source, an integrated circuit, an optical fiber, and a polarization controller. The optical source is arranged emit an optical signal. The integrated circuit includes a mirror. The optical fiber carries the optical signal from the optical source to the integrated circuit. The mirror reflects a transverse magnetic component of the optical signal through the optical fiber to the optical source. The polarization controller adjusts, based on the transverse magnetic component, the optical signal emitted from the optical source such that the transverse magnetic component is reduced.

Forward polarization control for remote laser

Aspects described herein include an optical apparatus comprising a plurality of light-carrying media, a wavelength division multiplexing (WDM) device optically coupled with the plurality of light-carrying media, and a lens arranged between the WDM device and a multicore optical fiber. An arrangement of the plurality of light carrying media and the WDM device are selected to align each of the plurality of light-carrying media with a respective optical core of the multicore optical fiber.

Coupling multiple optical channels using a z-block

Radiation-induced birefringence in polarization-maintaining fiber

Techniques for aligning each of a plurality of optical fibers for coupling to a photonic integrated circuit (PIC). Transmission is detected from each respective optical fiber to the PIC using a probe, and the respective optical fiber is aligned based on the detected transmission. Each of the plurality of optical fibers is coupled to the PIC using at least one of: (i) laser splicing, (ii) laser spot welding, or (iii) arc welding.

Splicing optical fibers to photonic integrated circuits

Aspects described herein include a method including arranging a laser die on a substrate. The laser die has multiple channels that are arranged with a first planar arrangement proximate to a facet of the laser die. The substrate is arranged on a housing component. The method further includes aligning a single lens to the facet, and aligning a multicore optical fiber to the laser die through the single lens. The multicore optical fiber has a plurality of optical cores that are arranged with a second planar arrangement. Aligning the multicore optical fiber to the laser die includes attaching the multicore optical fiber to the housing component and rotationally aligning the multicore optical fiber to align the second planar arrangement with the first planar arrangement.

Coupling multi-channel laser to multicore fiber

Aspects described herein include a method of fabricating an optical component. The method comprises electrically coupling different laser channels of a laser die to different electrical leads, testing a respective optical coupling of each of the different laser channels, optically aligning an optical fiber with a first laser channel of the different laser channels having the greatest optical coupling, and designating a second laser channel of the different laser channels as a heater element for the first laser channel.

Aspects described herein include an apparatus supporting optical alignment with one or more optical waveguides optically exposed along an edge of a photonic integrated circuit (IC). The apparatus comprises a frame body comprising an upper portion defining a reference surface, and a lateral portion defining an interface for an optical connector connected with one or more optical fibers. The lateral portion comprises one or more optical components defining an optical path through the lateral portion. The one or more optical components are arranged relative to the reference surface such that the one or more optical components align with (i) the one or more optical waveguides along at least one dimension when the reference surface contacts a top surface of an anchor IC, and with (ii) the one or more optical fibers when the optical connector is connected at the interface.

Growing community of inventors

Allentown, PA, United States of America

Norbert Schlepple