Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Norbert Lützow

Gabriela Schmidt

Dirk Tews

Josef Gaida

Wonjin Cho

Fabian Michalik

Martin Thoms

Markku Lager

Felix Tang

Mirko Kloppisch

Aaron Hahn

Thomas Hülsmann

Toshio Honda

The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:

Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer

An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each Ris a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.

Etching solution for copper and copper alloy surfaces

The present invention relates to an aqueous composition for and a process for etching copper and copper alloys applying said aqueous composition. The aqueous composition comprises a source for Feions, at least one acid, at least one triazole or tetrazole derivative, and at least one etching additive selected from N-alkylated iminodipropionic acid, salts thereof, modified polyglycol ethers and quaternary ureylene polymers. The aqueous composition is particularly useful for making of fine structures in the manufacture of printed circuit boards, IC substrates and the like.

Aqueous composition for etching of copper and copper alloys

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Berlin, Germany

Norbert Lützow