Atotech Deutschland Gmbh

Norbert Luetzow

Dirk Tews

Christian Sparing

Martin Thoms

To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N(R)(R)&#x2014;(CH)&#x2014;N(H)&#x2014;C(Y)&#x2014;N(H)&#x2014;(CH)&#x2014;N(R)(R)&#x2014;R}n X, with R, R, R, R, R, Y and Xbeing defined as claimed.

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Berlin, Germany

Norbert Luetzow