Cree Gmbh

Norbert Hiller

Gerald H Negley

Nicholas William Medendorp, Jr

Peter Scott Andrews

Russell George Villard

Antony Paul Van De Ven

Bernd P Keller

James Ibbetson

John Adam Edmond

David Beardsley Slater, Jr

Ban Poh Loh

Scott Schwab

Nathaniel O Cannon

Mitch Jackson

Jr Nicholas W Mendendorp

A LED lighting device includes at least one waveguide element and multiple light-emitting sources such as LEDs or LED packages, which may be optically coupled though different light entry regions to the at least one waveguide. Multiple light solid state sources may be arranged in strips. A waveguide system includes first and second body structures each positioned to illuminate at least a portion of a target surface. One or more waveguides may be arranged to illuminate a LCD panel.

LED lighting devices incorporating waveguides

A display panel for a flat panel display includes a planar array of LCD devices and a planar array of LED devices that is closely spaced apart from the planar array of LCD devices, at least some of the LED devices being disposed within a periphery of the array of LCD devices such that, in operation, the planar array of LED devices provides backlighting for the planar array of LCD devices. The planar array of LED devices can include at least one solid metal block having first and second opposing metal faces. The first metal face includes therein an array of reflector cavities, and the second metal face includes therein heat sink fins that are exposed at the back face of the flat panel display.

Light emitting diode arrays for direct backlighting of liquid crystal displays

A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided.

Semiconductor light emitting devices and submounts

A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.

Semiconductor light emitting device packages and methods

A LCD system including multiple light sources optically coupled through different light entry regions to at least one waveguide element positioned to backlight a LCD panel. A LCD system including multiple light sources coupled to light entry regions of two or more waveguides comprising a waveguide system positioned to backlight a LCD panel. Waveguides of various configurations and promoting even lighting of associated LCD panels are provided. Resulting LCD systems enable uniformly lit panels having diagonal measurements in excess of 12 to 14 inches, but the invention is not limited to panels of any particular size.

LED backlight system for LCD displays

A light emitting apparatus is fabricated by measuring light output of a semiconductor light emitting device, and selectively applying luminous material to the light emitting device based on the measured output of the light emitting device. An amount of luminous material, different compositions of luminous material and/or different doping levels of luminous material may be selectively applied based on the measured output of the light emitting device.

Methods of selectively applying luminous material to light emitting devices based on measured output thereof

Lighting systems for emitting light in multiple directions including one or more light emitting devices (LEDs) and a housing configured to receive the one or more LEDs are provided. The one or more LEDs are configured to generate light in a first direction to illuminate a first area proximate to the lighting system. The housing is configured to reflect a portion of the generated light so as to allow a remaining portion of the generated light to pass through the housing in a second direction, different from the first direction, and illuminate a second area proximate to the lighting system. Related methods are also provided herein.

Light emitting device (LED) lighting systems for emitting light in multiple directions and related methods

Methods for forming semiconductor light emitting devices and submounts

A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.

Broad spectrum light emitting devices and methods and systems for fabricating such devices are provide. Such devices may include a light emitting element, such as a diode or laser, which emits light in a predefined range of frequencies, and luminous material on the light emitting diode. The characteristics of the luminous material, such as the amount, composition and/or doping of the luminous material or materials may be based on measured light output of the light emitting device, such as the measured output frequency and/or power of the light emitting device.

Growing community of inventors

Chapel Hill, NC, United States of America

Norbert Hiller