Asm Assembly Systems Gmbh & Co. Kg

Norbert Heilmann

Thomas Rossmann

Stefan Seitz

Stefan Magg

Stefan Geiger

Johannes Justinger

A magazine () is described for portion-wise receiving individualized bulk electronic components (). The magazine () comprises (a) a receiving structure () which comprises multiple closable receiving cavities (), which are arranged along a longitudinal axis () of the receiving structure (); (b) a cover structure () which is arranged at an upper side of the receiving structure (), displaceable along the longitudinal axis (), so that in a closed position of the cover structure () all receiving cavities () are covered and in one opening position of multiple opening positions at least one receiving cavity () is free; and (c) a closure foil () which encompasses the cover structure () along the longitudinal axis () in the form of a closed tape, wherein at least a part of the closure foil () is releasably connected to the receiving structure (). Further, a device () is described for portion-wise transferring components () from one such magazine () into a reservoir () for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine () into the one such reservoir ().

Portion-wise filling of a reservoir with bulk components

A method for mounting an electronic component () onto a component carrier () is described. The method comprises (a) optically capturing a first image from a first side of the component (), at which first side a first structural feature () of the component () is discernible, by means of a first camera (), (b) optically capturing a second image from a second side of the component (), at which second side a second structural feature () of the component () is discernible, by means of a second camera (), wherein the first side and the second side are situated opposite one another and wherein the second structural feature () is configured to be connected at a predetermined position on the component carrier (), (c) orienting the electronic component () such that a center of the first structural feature () is aligned with a desired position relative to the component carrier (), wherein the second structural feature () can be correspondingly offset from the predetermined position, and (d) mounting the electronic component () onto the component carrier (), wherein the center of the first structural feature () is aligned relative to the component carrier (), wherein the second structural feature () is offset from the predetermined position. Moreover, a method for checking the functionality of an optoelectronic component in advance of a population of a component carrier and an automatic placement machine for mounting an optically measured electronic component are also described.

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Munich, Germany

Norbert Heilmann