International Business Machines Corporation

Norbert Freisitzer

Rolf G Meinert

William A Brady

Julius J Perlini

See Ark Chan

Prakash Nahata

Mario G Tavares

Douglas A West

A dry film photoresist laminator includes a punch and die assembly 24 which punches a rolled sheet dry film photoresist material 14, that is comprised of a dry film photoresist material 18 sandwiched between a Mylar top layer 16 and a polyolefin bottom layer 20, into photoresist decals. The photoresist decals are bonded to a tacky transport tape 40 which carries the decals to a polyolefin peeler assembly 54 that rolls a high tack tape 57 along the polyolefin layer 20 of the decal, thereby peeling it from the decal. The decal is advanced by a laminating assembly 44 which rolls the decal onto a heated wafer 72, thereby bonding the exposed photoresist material 18 to the wafer 72. Bonded wafer 72 and decal 14 are removed from the transport tape 40. A tape transport assembly 44 carrying the transport tape and decal is advanced through the various process steps.

Photo resist film application mechanism

A dry film photoresist laminator includes a punch and die assembly 24 which punches a rolled sheet dry film photoresist material 14, that is comprised of a dry film photoresist material 18 sandwiched between a Mylar top layer 16 and a polyolefin bottom layer 20, into photresist decals. The photoresist decals are bonded to a tacky transport tape 40 which carries the decals to a polyolefin peeler assembly 54 that rolls a high tack tape 57 along the polyolefin layer 20 of the decal, thereby peeling it from the decal. The decal is advanced to a laminating assembly 71 which rolls the decal onto a heated wafer 72, thereby bonding the exposed photoresist material 18 to the wafer 72. The bonded wafer 72 and decal are advanced to a Mylar peeler assembly 82 which strips the transport tape 40 and the Mylar layer 16 away from the wafer 72, thereby leaving a wafer 72 which laminated with dry film photoresist material 18.

Dry film resist transport and lamination system for semiconductor wafers

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Hyde Park, NY, United States of America

Norbert Freisitzer