Freescale Semiconductor,inc.

Norazham Mohd Sukemi

Navas Khan Oratti Kalandar

Kesvakumar V C Muniandy

Chee Seng Foong

A surface mount semiconductor device having external contact elements exposed in a ball grid array (BGA) at its external active face for mechanical and electrical connection to an external support and a semiconductor die connected electrically internally with the external contact elements. A reinforcement layer of electrically insulating material extends between and surrounds laterally peripheral contact elements of the BGA. The reinforcement layer extends to from about thirty percent (30%) to about fifty percent (50%) of the height of the peripheral contact elements at the active face.

Surface mount semiconductor device with solder ball reinforcement frame

A semiconductor device has external, exposed electrical contacts at an device active face and a semiconductor die, which has internal, electrical contacts at a die active face. The exposed contacts are offset from the internal contacts laterally of the device active face. A redistribution layer includes a layer of insulating material and redistribution interconnectors within the insulating material, the interconnectors connecting with the exposed contacts. A set of conductors connect the internal contacts and the interconnectors. The conductors have oblong, tear drop shaped cross-sections extending laterally of the die active face beyond the respective internal contacts, and contact the interconnectors at positions spaced further apart than the internal contacts. The redistribution layer may be prefabricated using less costly manufacturing techniques such as lamination.

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Subang, Malaysia

Norazham Mohd Sukemi