Plume Design, Inc.

Nora Yan

Liem Hieu Dinh Vo

Richard Chang

Jeffrey ChiFai Liew

William John McFarland

Duc Minh Nguyen

Yoseph Malkin

Brian Nam

Ming-Tsung Su

Irene Yang

Shu-Chun Shen

Miroslav Samardzija

Patrick Hanley

Guan-Heng Chen

Hiroshi Mendoza

Wireless electronic device

A wireless access point includes a physical form factor including a plurality of sides each adjacent to a bottom portion, wherein the physical form factor houses a plurality of components including i) at least one Printed Circuit Board (PCB) having one or more Wi-Fi radios and a Bluetooth radio and ii) a power supply; and an electrical plug connected to the power supply and extending from the bottom portion for insertion into an electrical outlet for power and for physical support of the wireless access point adjacent to the electrical plug.

Compact, direct plugged, and high-performance Wi-Fi access point

A compact electronic device includes a base with a plurality of sides each adjacent to a bottom portion, wherein the base houses components comprising a heatsink supporting a fan module located in an interior portion, a Printed Circuit Board (PCB), and a power supply, and wherein vents are disposed on the bottom portion and side vents are disposed on one or more of the plurality of sides; a top cover configured to attach to the base via the plurality of sides forming an air gap extending each of the plurality of sides, wherein the air gap supports air exhaust on one or more sides of the plurality of sides and air intake on the remaining sides; and an electrical plug connected to the power supply and extending out of the bottom portion for insertion into an electrical outlet for power and to physically support the compact electronic device.

Cooling of a compact electronic device

An electronic device includes a first circuit board and a second circuit board each stacked relative to one another; and a mid-spreader disposed between the first circuit board and the second circuit board, wherein the mid-spreader includes a heat conductive material in thermal contact with one or more components on each of the first circuit board and the second circuit board to act as a heat sink, and wherein the mid-spreader is thermally connected to one or more heat sinks, the mid-spreader is one of disposed to or integrally formed with the one or more heat sinks, and the mid-spreader extends beyond a size of at least one of the first circuit board and the second circuit board to conduct and transfer heat therefrom.

Mid-spreader for stacked circuit boards in an electronic device

Growing community of inventors

Taipei, Taiwan

Nora Yan