Viasat, Inc.

Other

U.S. Monolithics, L.l.c.

Noel A Lopez

Charles E Woods

Kenneth V Buer

Michael R Lyons

Jon Filreis

Rob Zienkewicz

David R Laidig

Dave Laidig

Dean Lawrence Cook

David R Saunders

Stefano Vaccaro

Daniel Llorens Del Rio

Ferdinando Tiezzi

David R Lang

John Filreis

A frequency synthesis system includes a memory to store first and second digital control word pairs that each include a first and second control word. A first DAC system generates an analog sampling signal having a first sampling frequency based on a fixed clock signal and the first control word of the first pair during a first time duration having a second sampling frequency based on the first control word of the second pair during a second time duration. A second DAC system generates an analog output signal based on the second control word of the first pair and the first sampling frequency at the first time duration and based on the second control word of the second pair and the second sampling frequency at the second time duration. The analog output signal has a same predetermined output frequency at both the first and second time durations.

Frequency synthesis systems

A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Leadframe package with integrated partial waveguide interface

In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.

Multi-level power amplification system

A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W.

System and method for integrated waveguide packaging

In accordance with various aspects of the present invention, a method and system for designing an inclined antenna array with a hybrid mechanical-electronic steering system with improved radiation performances at low elevation angles is presented. In an exemplary embodiment, a radiating element structure is attached to a mounting surface and includes a patch antenna and a ground plane. The bottom edge of the patch antenna is farther from the mounting surface than the top edge of the patch antenna. If the radiating element structure is used in an inclined array antenna, then the patch antenna has an uncovered view of a low elevation angle. Furthermore, at least a portion of a patch antenna may be uncovered and have a clear view. A clear view of the low elevation angle results in increased directivity and increased polarization quality due to reduced signal scattering.

Inclined antenna systems and methods

A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.

A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. The power amplifier modules and RF waveguide may be distributed about the heat spreader in different planes. Furthermore, the power amplifier modules may be located on opposite sides of the heat spreader and nonplanar to the waveguide split block. A method for dissipating heat within an SSPA may include receiving an RF signal in a first plane, amplifying the RF signal in another plane, and combining the RF signal in yet another plane.

Multi-planar solid state amplifier

In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. The interface comprises an isolation wall placed between an input and output region of an integrated circuit to reduce ripple and isolate the waveguide cavity from the monolithic microwave integrated circuit circuitry. The interface further comprises a turning screw or other similar member that is configured to closely match the impedance of integrated circuitwith the impedance at interfaceto further reduce loss.

Adjustable low-loss interface

In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.

Low-loss interface

An RF power detector having a wide dynamic range may comprise a chopping amplifier and is configured to detect pulsed high frequency RF signals. The chopping amplifier controlled by a bias current regulator amplifies and chops an RF signal by periodically enabling and disabling the amplifier according to a system clock. The chopped high frequency RF signal feeds a Schottky diode biased to operate in the square law region for weak signals. The Schottky diode voltage is tapped and high pass filtered. The voltage drives a logarithmic and linear converter. The converter outputs are summed to produce an output voltage that is a repeatable and stable monotonically increasing function of the RF power.

RF power sensor with chopping amplifier

A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. An MMIC power amplifier module may include a backing, a board, at least one MMIC, and/or a cover. A method for dissipating heat within an SSPA may include receiving an RF signal, splitting the RF signal, amplifying multiple RF signals, combining the multiple RF signals, generating heat, and/or dissipating heat.

Growing community of inventors

Chandler, AZ, United States of America

Noel A Lopez