Citizen Electronics Co., Ltd.

Citizen Holdings Company, Ltd.

Citizen Watch Company, Ltd.

Nichia Corporation

Nodoka Oyamada

Takashi Iino

Junji Miyashita

Kosuke Tsuchiya

Kenji Imazu

Koichi Fukasawa

Shunsuke Minato

Takeshi Kususe

Yuji Omori

Kazuki Matsumura

Koki Hirasawa

Toshiaki Ogawa

Yuichi Hasumi

Shusaku Mochizuki

A light-emitting apparatus and a method for manufacturing the same are provided in which heat dissipation from an LED package to a heat sinking substrate is improved while electrical insulation therebetween is ensured. The light-emitting apparatus includes a circuit board having an opening, an LED package inserted into the opening from the back side of the circuit board and having an edge connected to the back side of the circuit board, and a heat sinking substrate disposed on the back side of the circuit board so as to be in contact with the LED package. The LED package includes: an LED device; a lead frame including a mounting part having an upper surface on which the LED device is mounted and a back surface being in contact with the heat sinking substrate, and an electrode part being thinner than the mounting part and electrically connected to the LED device and the circuit board; an insulating resin filled between the mounting part and the electrode part and between the electrode part and the heat sinking substrate; and a sealing resin filled into a region on the mounting part to seal the LED device.

Light emitting apparatus and method for manufacturing same

Provided is a light-emitting device including a mount board, an LED element mounted on the mount board, and a translucent or transparent sealing resin being filled onto the mount board to seal the LED element. The sealing resin contains first and second particulate phosphors excited by emitted light from the LED element, and a nanoscale filler having an average particle size in the range of 1 nm to 100 nm. The specific gravity of the first particulate phosphor is smaller than that of the second particulate phosphor. The sealing resin includes a dispersion layer of the first particulate phosphor covering areas obliquely above and beside the LED element, and a deposition layer of the second particulate phosphor on upper surfaces of the mount board and the LED element. The first particulate phosphor is dispersed in the dispersion layer among aggregates formed by particles of the nanoscale filler.

Light-emitting device

A light-emitting device in which the emission intensity of light-emitting elements is improved by making heat generated by light emission of the light-emitting elements be effectively released is provided. The light-emitting device includes a mounting substrate including a mounting region, light-emitting elements mounted on the mounting region, a sealing resin which contains a phosphor and integrally seals the light-emitting elements, and at least one heat transfer member which is arranged among the light-emitting elements on the mounting region, is embedded in the sealing resin, and has a higher thermal conductivity than the sealing resin.

Light emitting device

Light-emitting diode

A light-emitting device includes a base, a substrate, a plurality of light-emitting elements, a filler, and a sealing resin body. The base includes an upper surface and a mounting area. The substrate is disposed on the upper surface of the base. The substrate includes an opening. The mounting area is exposed from the opening of the substrate. The plurality of light-emitting elements are disposed on the mounting area of the base at predetermined intervals with one another. The filler is disposed around each of the plurality of light-emitting elements. The sealing resin body includes a phosphor. The sealing resin body is configured to seal the light-emitting elements and the filler.

An object of the present invention is to provide a light-emitting device having a temperature compensation function implemented with simple circuitry, and a method of temperature compensation in such a light-emitting device. More specifically, the invention provides a light-emitting device and a method of temperature compensation using a light-emitting device, wherein the light-emitting device includes a substrate, a first LED chip which is arranged on the substrate, and which has a characteristic such that &#x394;x and &#x394;y, each representing an amount of displacement on an xy chromaticity diagram, both are negative as temperature rises, and a second LED chip which is arranged on the substrate, and which has a characteristic such that &#x394;x and &#x394;y, each representing an amount of displacement on an xy chromaticity diagram, both are positive as temperature rises.

Light-emitting device and method for compensating chromaticity of light-emitting device

In a first aspect of the present inventive subject matter, a lighting device includes a light-emitting deviceincluding p-contact and n-contact that are separately arranged from each other on a first surface of the light-emitting element and a phosphor layer including a phosphor particle and covering the light-emitting elementexcept the p-contact and n-contact of the light-emitting element, the phosphor layer includes a higher density of the phosphor particle on a position of the first surface between the p-contact and the n-contact of the light-emitting element than on a position of a second surface that is an opposite surface of the first surfaceof the light-emitting element.

Lighting device

Provided is an LED device which is compact while having good luminous efficiency and a focused light distribution. This LED device is provided with: a reflective frame around the outer periphery of the LED device; an LED die which has a transparent insulating substrate, a semiconductor layer formed on the bottom surface of the transparent insulating substrate, and an outer connection electrode disposed on the semiconductor layer; and a fluorescent member which is disposed on at least the top surface of the LED die and which converts the wavelength of the light emitted from the LED die. On the inside of the reflective frame is an inclined surface in contact with the lateral surface of the fluorescent member, and the inclined surface is formed such that the inner diameter of the reflective frame widens from the bottom surface towards the top surface of the LED die. Also provided is a manufacturing method of the LED device.

Manufacturing method of light emitting device in a flip-chip configuration with reduced package size

A semiconductor device has a light emitting element, and a resin layer; the light emitting element includes a semiconductor laminated body in which a first semiconductor layer and a second semiconductor layer are laminated in sequence, a second electrode connected to the second semiconductor layer on an upper surface of the second semiconductor layer that forms an upper surface of the semiconductor laminated body, and a first electrode connected to the first semiconductor layer on an upper surface of the first semiconductor layer in which a portion of the second semiconductor layer on one surface of the semiconductor laminated body is removed and a portion of the first semiconductor layer is exposed; and the resin layer is configured to cover at least a side surface of the light emitting element, and an upper surface of the resin layer is lower than the upper surface of the semiconductor laminated body.

Light emitting device including light emitting element, outer connection electrodes and resin layer

In an aspect of the present invention, a light-emitting device includes a substrate; a first electrode and a second electrode arranged on an upper surface of the substrate with a gap between the first electrode and the second electrode, the gap being positioned at a central portion of the upper surface of the substrate; a first light-emitting diode element electrically mounted on the first electrode; and a second light-emitting diode element electrically mounted on the second electrode, wherein the first electrode includes a first inner portion and a first outer portion that are two equal area portions divided at a center line of the first electrode, and the first light-emitting diode element is mounted on the first outer portion of the first electrode, and wherein the second electrode includes a second inner portion and a second outer portion that are two equal area portions divided at a center line of the second electrode, and the second light-emitting diode element is mounted on the second outer portion of the second electrode.

Light-emitting device including light-emitting diode element that is mounted on outer portion of electrode

A light-emitting device is provided that aims not to affect a service life and characteristics of light emission and includes two electrodes formed on the upper surface of a substrate with a gap at a central portion of the upper surface of the substrate between the two electrodes, a first light-emitting diode element mounted on the first electrode, and a second light-emitting diode element mounted on the second electrode. The first light-emitting diode element includes a pair of element electrodes on an upper surface of the first light-emitting diode element and the second light-emitting diode element includes a pair of element electrodes on an upper surface of the second light-emitting diode element. The first light-emitting diode element is connected by a wire to the first electrode and/or the second electrode. The second light-emitting diode element is connected by a wire to the first electrode and/or the second electrode.

A light-emitting device includes a substrate (), a light-emitting element () mounted on the substrate (), a first resin () disposed to cover an upper portion of the light-emitting element (), a second resin () disposed to cover a lower portion of the light-emitting element (), a first phosphor () contained in the first resin (), and a second phosphor () contained in the second resin (). The first phosphor () converts light emitted directly from the light-emitting element () into a first phosphor-converted light having a wavelength longer than that of the light emitted directly from the light-emitting element () and emits the first phosphor-converted light, and the second phosphor () converts the light emitted directly from the light-emitting element () into a second phosphor-converted light having a wavelength longer than that of the first phosphor-converted light and emits the second phosphor-converted light. Because both the first and second resins () have portions in contact with the light-emitting element (), respectively, the first and second phosphors () receive the light emitted directly from the light-emitting element () to convert the light emitted from the light-emitting element () into the first and second phosphor-converted lights, respectively. Positions of the first and the second resins are arranged depending on the wavelength range of light which respective phosphors can convert.

An object of the present invention is to provide an LED device that can achieve a large total luminance flux while also achieving a structure, using a phosphor sheet, that is compact in size and easy to produce and whose color emission is easy to manage, and a method for producing such an LED device. A semiconductor light-emitting device including a semiconductor light-emitting element which includes a transparent insulating substrate and a semiconductor layer formed on a lower surface of the transparent insulating substrate, a phosphor resin which covers a side face of the transparent insulating substrate, and which wavelength-converts a portion of light emitted from the semiconductor light-emitting element, and a phosphor sheet which covers an upper surface of the phosphor resin and is bonded to the transparent insulating substrate, wherein the phosphor sheet has a top plan shape that is identical with an outer peripheral shape of the phosphor resin, and the top plan shape of the phosphor sheet defines an overall outer plan shape of the device.

Growing community of inventors

Fujiyoshida, Japan

Nodoka Oyamada