Hitachi Chemical Company, Ltd.

Akebono Brake Industry Co., Ltd.

Other

Tokyo Shibaura Denki Kabushiki Kaisha

Akebono Research and Developement Centre Ltd.

Akebono Research and Development Center Ltd.

Japan Pet Drugs Co., Ltd.

Nihon Doubutsu Yakuhin Kabushikigaisva

Nihon Doubutsu Yakahin Kabushikigaisya

Nobuyuki Yoshida

Isao Karube

Yusuke Konishi

Takashi Morita

Yoshiki Tani

Ryosuke Shibasaki

Satoshi Yonehara

Kiyoko Yano

Hiroshi Kanasugi

A method for manufacturing a multilayer wiring board includes a step (1) and a step (2). The step (1) disposes a hole for through-hole, a squirt of metal foils, and a lower space. The squirt of the metal foils on both the sides of the insulating layer is formed at an opening of the hole for through-hole. The lower space is formed between the squirt of the metal foils and an inner wall of the hole for through-hole. The step (2) plugs up the hole for through-hole by forming an electrolytic filled plating layer at an inside of the hole for through-hole and on the metal foils on both the sides of the insulating layer. The plugging of the hole for through-hole in the step (2) is performed by once decreasing a current density of an electrolytic filled plating in a middle of the electrolytic filled plating and then increasing the current density again.

Method for manufacturing multilayer wiring board

The present invention is a method for manufacturing a multilayer wiring board having (1) a step of providing with a hole for a via hole, an overhang of a metal foil formed at an opening of the hole, and lower space formed between the overhang and an inside wall of the hole, by using a conformal method or a direct laser method; and (2) a step of filling in the hole by forming electrolytic filling plating layers within the hole and on the metal foil, wherein the filling-in of the hole by the formation of electrolytic filling plating layers in the step (2) is carried out by temporarily decreasing the electric current density of electrolytic filling plating in the middle of the electrolytic filling plating, and increasing it again.

Method for manufacturing multilayer wiring substrate

The present invention is a method for manufacturing a multilayer wiring board having (1) a step of providing with a hole for a via hole from a metal foil for an upper layer wiring pattern to an inner layer wiring pattern by using a conformal method or a direct laser method, and (2) a step of forming a via hole by forming electrolytic filling plating layers in the hole for a via hole, wherein the formation of the electrolytic filling plating layers in the step (2) is carried out by repeating change in electric current density of temporarily decreasing the electric current density of electrolytic filling plating in the middle of the electrolytic filling plating and then increasing it again, two or more times before the electrolytic filling plating layers block an opening of the hole for a via hole.

The present invention is a multilayer wiring board and a method for manufacturing the same, the multilayer wiring board having a hole for interlayer connection penetrating a metal foil and an insulating layer; an overhang of the metal foil formed at an opening of the hole; lower space formed between the overhang and an inside wall of the hole; and interlayer connection in which the hole is filled with electrolytic filling plating layers, wherein the electrolytic filling plating layers are formed as at least two or more layers, the lower space is filled with any electrolytic filling plating layer except for an outermost layer of the two or more layers of electrolytic filling plating layers, and a diameter in the inside of the interlayer connection formed by any electrolytic filling plating layer except for an outermost layer is equal to or larger than a diameter of the opening.

Multilayer wiring board and method for manufacturing same

To provide a method for manufacturing a multilayer wiring substrate, in which an insulating layer and a metal foil provided thereon are integrally laminated on an inner layer material having a wiring formed thereon, in which a hole for via hole is formed in the metal foil and the insulating layer, and in which the hole for via hole is filled with an electrolytic filled plating layer after a base electroless plating layer is formed, the method being featured in that, after the base electroless plating layer is formed, first, an electrolysis filled plating layer is formed to the extent that the hole for via hole is not completely filled, and then, after the surface of the electrolytic filled plating layer is etched, the hole for via hole is completely filled by an electrolytic filled plating layer.

The present invention provides a fructosylamine oxidase which is obtainable by culturing, and purifying two types of fructosylamine oxidase (FAO) with different substrate specificities from the culture, and which is useful in the measurement of amadori compounds.

Fructosylamine oxidase

The error of a sensor in motion capture system is corrected. An acceleration sensor determines the direction of gravity (G) in a still initial state. The direction Gwill never change always if a drift dose not occur. However, actually if an object to which an acceleration sensor is attached moves along a coordinate axis, the direction gradually changes due to a drift with time. According to the invention, after a given time has passed, the acceleration sensor is stopped to determine the direction of gravity. Referring to the data on this determination, the true direction of gravity to be judged is compared with the direction of gravity Ginfluenced by the drift. The difference between them is assumed to be an error due to a drift, and the error is subtracted from the determined value to correct the error of the measurement value. Similarly to the direction of gravity, assuming that there is an error in any direction in the coordinate system, the errors are corrected, and more accurate motion determination is possible.

Difference correcting method for posture determining instrument and motion measuring instrument

Microbial electrode and microbial sensor

In a heater unit comprising a case 10 which accommodates therewithin an electrical heating element 11 and a temperature sensor 12 for detecting the temperature of the case 10 heated by the electrical heating element 11 to stop the power supply to the electrical heating element 11 when the temperature reaches a predetermined value, there is provided a heat conductive path 20 made of a material having a higher heat conductivity than that of the material making up the case 10 and extending from a region corresponding to the space in which the electrical heating element 11 or heater is placed to a region corresponding to the space in which the temperature sensor 12 or temperature detecting and power supply control member is placed. Thus, the heater unit for an aquarium fish tank is prevented from being extraordinarily heated when the tank has been destroyed.

Heater for aquarium fish tank

A spawning case for use in an aquarium comprises in combination a rectangular case body (A) and filter (B). The case body (A) is arranged within the aquarium so as to communicate with water. The case body A includes a multiplicity of passage slits (11) and a W-shaped partition member (20) having communication paths (24) formed at its valleys. The filter (B) is removably mounted on the external surface of the case body (A). The filter (B) includes on its one side an intake (C) which is brought into intimate contact with the passage slits (11), and at its upper portion a discharge port (33) capable of being selectively directed toward either the interior or the exterior of the case body (A).

Spawning case for use in an aquarium

Method of producing .beta.-cyclodextrin

A growth promoter for aquatic plants, which increases the carbonate concentration in water to promote the growth of aquatic plants and contains phosphate as an active component, and a method for applying said growth promoter, which comprises placing an aqueous solution or dispersion of the growth promoter in a container of which one end is narrowly opened and placing the container in water in a water tank thereby to allow the growth promoter to ooze through the narrowly opened end.

Growth promoter for aquatic plant and method for application thereof

A microprogram control system of the invention has a mapping read only memory storing the respective initial addresses of a plurality of microprogram routines corresponding to a macroinstruction. The address input information to this mapping read only memory is obtained from an output of a binary counter which counts every time a JUMP instruction for making a branch to another microprogram routine is decoded, and from an output of a latch circuit for holding the operation code of the macroinstruction. When the microprogram routine has loops, a count inhibit signal is input to the binary counter so that the same address input information may be supplied to the mapping read only memory.

Growing community of inventors

Tokyo, Japan

Nobuyuki Yoshida