Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Nobuyuki Yasui

Hiroshi Aruga

Koichi Nakamura

Tatsuo Hatta

Nobuo Ohata

Tetsuhiro Fukao

Mizuki Shirao

A terminal portion configured to obtain electrical connection with a printed circuit board includes a first signal pad that is formed in a first conductor layer and is electrically separated from a ground layer, a pair of first ground pads that is formed in the first conductor layer to sandwich the first signal pad and is connected to the ground layer, a second signal pad that is formed in a second conductor layer and is connected to a signal line, a pair of second ground pads that is formed in the second conductor layer to sandwich the second signal pad and is electrically separated from the signal line, a third signal pad formed in a third conductor layer, and a pair of third ground pads formed in the third conductor layer to sandwich the third signal pad. The second signal pad is wider than the third signal pad.

Flexible printed circuit board and circuit-board connection structure

An optical module includes: a pedestal; a glass optical multiplexer/demultiplexer fixed onto the pedestal via a UV adhesive; and a metal block which is smaller than the glass optical multiplexer/demultiplexer and is fixed to a top surface of the glass optical multiplexer/demultiplexer.

Optical module and method of manufacturing the same

A light emitting device capable of adjusting height difference between the light emitters and optical waveguides individually and easily with high accuracy is realized. The light emitting device comprises multiple light emitters; an optical multiplexer comprising the openings of multiple optical waveguides at the incidence end for light from the multiple light emitters and the opening of an optical waveguide combining said multiple optical waveguides at the light exit end; and multiple drivers driving said multiple light emitters, respectively, along the tilt direction of a surface tilted at a given angle with respect to the surface on which said optical waveguides are formed, wherein said light emitters are provided at an angle that makes the central axes of light from said light emitters in the light emission direction parallel to the surface on which said optical waveguides are formed.

Light emitting device

An optical module comprises: a stem; a protruding portion on a surface of the stem; an optical semiconductor device mounted on the protruding portion; a power supply terminal penetrating through the stem, the power supply terminal being insulated from the stem; a first dielectric substrate mounted on the protruding portion; a first signal line on the first dielectric substrate and connected to a first end of the power supply terminal; a second dielectric substrate on a rear surface of the stem; and a second signal line on the second dielectric substrate and connected to a second end of the power supply terminal. The second signal line has an electrical length of 23.0-36.2 mm and an impedance of 21.5-24.5&#x3a9;.

Optical module

An optical semiconductor device package includes a disc-shaped stem, metallic leads in rod form penetrating the stem in the direction of the thickness to protrude from a main surface of the stem, and a mount extending vertically from the main surface of the stem, with a plane part of the mount facing the leads. A dielectric substrate is mounted on the plane part, and an optical semiconductor chip is mounted thereon. Two impedance-adjusting dielectric substrates which are rectangular in plan view are provided extending in parallel with the leads, to cover the plane part facing the leads.

Growing community of inventors

Tokyo, Japan

Nobuyuki Yasui