Nissan Motor Company Limited

Asahi Kasei Kogyo Kabushiki Kaisha

Nobuyuki Yamaguchi

Hideo Nomura

Hidekazu Ishimura

Junichi Asano

Isao Takagi

Koichi Yamamoto

Kenji Ishibashi

Hidetoshi Imazu

Masaaki Todoroki

An apparatus for producing a variable configuration die by using a plurality of pins is disclosed. The apparatus comprises a pin storing device for storing the pins therein; a pin piling device in which the variable configuration die is to be produced; a robot device for transferring the pins from the pin storing device to the pin piling device for making up the variable configuration die; and a computer-aided control device for controlling the robot means in such a manner that the pins carried by the robot means are placed onto given positions of the pin piling device to cause the variable configuration die thus made of the piled pins in the pin piling device to have a layered structure. The variable configuration die thus made up has a recessed die surface which is defined by one ends of the piled pins.

Apparatus and method for producing variable configuration die

In order to increase the performance of a mold of thermosetting resin, metal powder is dispersed in the resin mold which has a dense and voidless structure. The mold may be mounted on a back-up member of metal. In this case, the bonding between the mold and the back-up member is much assured when metal balls are contained in the mold near the back-up member. Furthermore, the mold may be electrically metal-plated. In this case, the mold is coated with a conductive plastic paint before being subjected to the electric metal plating in an electrolytic solution.

Metal-powder filled epoxy resin mold

Growing community of inventors

Yokohama, Japan

Nobuyuki Yamaguchi