Anelva Corporation

Ebara Corporation

Mitsubishi Electric Corporation

Sony Corporation

Resonac Corporation

Sony Computer Entertainment Inc.

Mitsubishi Denki Kabushiki Kaisha

Showa Denko K.k.

Hitachi, Ltd.

Sony Interactive Entertainment Inc.

Other

Tokyo Electron Limited

Fuji Electric Co., Ltd.

Minolta Company, Ltd.

Ryobi Limited

Nobuyuki Takahashi

Toru Maruyama

Shigeru Mizuno

Kenji Iriguchi

Masahiko Kobayashi

Masahiro Sato

Suguru Sakugawa

Itsuki Kobata

Susumu Matsubara

Kazuhito Watanabe

Katsuhide Watanabe

Masahito Ishihara

Hiroaki Masuda

Takashi Kamiya

Keita Yagi

Yoichi Shiokawa

Yoichiro Numasawa

Shinya Hasegawa

Yoshihiro Katsumata

Masaki Kinoshita

Kiyotaka Kato

Takanori Yoshimura

Ryuji Sugimoto

Hajime Sahase

Hozumi Yasuda

Toshifumi Kimba

Ken Yano

Takuya Mayuzumi

Kenji Sakakibara

Yoshitsugu Sawa

Kenji Inomata

Kazuto Nakagawa

Kiyokazu Miyazawa

Yu Togasaki

Yasuyuki Shirai

Yuji Yagi

Ryoichi Ikeda

Mahito Matsuura

Toshiaki Koguchi

Tatsuya Suzuki

Osamu Nabeya

Hiroyuki Shinozaki

Toru Sasaki

Akira Miyata

Katsunori Tanaka

Tomohiro Ito

Shinichi Hirata

Koichi Takeda

Shigeru Kobayashi

Takashi Kishi

Takashi Okamoto

Mitsuhiko Watanabe

Shintaro Watanabe

Masahiro Sasaki

Nobuyuki Takada

Tadakazu Sone

Tomonori Sato

Kazuya Dobashi

Yoshitaka Sugawara

Hideo Miyata

Susumu Aiuchi

Hiroaki Kitahara

Tsutomu Tsukada

Tsuneaki Kamei

Kazuyoshi Horie

Kohei Yamamoto

Katsuo Abe

Ryoichi Oura

Yoshinori Tsujido

Shigeru Yamaki

Hiroomi Torii

Yasuhiko Akao

Junro Sakai

Toshiyuki Morita

Akio Takizawa

Manabu Tagami

Zhongxin Wen

Junji Kondo

Ryujin Ishiuchi

Ryohei Ito

Daisuke Fujino

Toshihiro Azuma

Takamasa Nakamura

Yukiyasu Domae

Ryosuke Kawanishi

Tomohiko Takeuchi

Tetsuo Ishida

Toru Kuronuma

Shinjiro Komatani

Hideki Tateishi

Hideyuki Sasaki

Yuka Mitani

Taichi Yokoyama

Yoshifumi Urakawa

Masayoshi Sakakibara

Shotaro Itami

Kenichi Kanazawa

Kiyoshi Nashimoto

An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

Substrate processing apparatus, substrate processing system, and substrate processing method

A polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, substrate, or panel, is disclosed. The polishing head system includes a polishing head having a plurality of piezoelectric elements configured to apply pressing forces to a workpiece, and an operation controller configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements.

Polishing head system and polishing apparatus

The present invention relates to a method of cleaning an optical film-thickness measuring system used for measuring a film thickness of a substrate, such as a wafer, while polishing the substrate. The method includes: cleaning an optical sensor head () by supplying a rinsing liquid into a through-hole () formed in a polishing pad () on a polishing table () before or after polishing of a substrate (W) with use of slurry, the optical sensor head () being located below the through-hole (); and discharging the rinsing liquid from the through-hole () through a drain line ().

Method of cleaning an optical film-thickness measuring system

Provided are: a resin composition for easily giving polishing pads which have a hardness suitable for chemical mechanical polishing and have voids of a desired size; a polishing pad produced from the resin composition; and a method for producing the polishing pad. The resin composition comprises a urethane (meth)acrylate (A), at least one unsaturated resin (B) selected from among vinyl ester resins and unsaturated polyester resins, an ethylenically unsaturated compound (C) which has an ethylenically unsaturated bond and is neither the urethane (meth)acrylate (A) nor the unsaturated resin (B), and a hollow object (D), wherein the mass ratio of the content of the urethane (meth)acrylate (A) to the content of the unsaturated resin (B), A:B, is 64:36 to 96:4 and the content of the hollow object (D) is 0.7-9.0 parts by mass per 100 parts by mass of the sum of the urethane (meth)acrylate (A), the unsaturated resin (B), and the ethylenically unsaturated compound (C).

Resin composition, polishing pad, and method for producing polishing pad

Bumper reinforcement for automobile

Stiffened member used for bumper reinforcement for automobile

A polishing-pad laminated structure which allows for easy alignment of a through-hole of a polishing pad with a sensor head installed in a polishing table is disclosed. The polishing-pad laminated structure includes a polishing pad and a release sheet. The polishing pad has a through-hole located at a position corresponding to a position of a sensor head disposed in the polishing table. The release sheet covers an adhesive surface of the polishing pad. The release sheet is divided into at least a first release sheet and a second release sheet. The first release sheet has a surface area smaller than a surface area of the second release sheet.

Polishing-pad laminated structure, polishing-pad positioning instrument, and method of attaching a polishing pad to a polishing table

One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

Polishing machine and a polishing method for a substrate

Growing community of inventors

Tokyo, Japan

Nobuyuki Takahashi