Sekisui Chemical Co., Ltd.

Nobuyuki Okinaga

Yoshiaki Tanaka

Ren-de Sun

Taku Sasaki

Shinya Uenoyama

Manabu Matsubara

Kiyoto Matsushita

Masaki Okuda

Hiroshi Kuroda

Ren-De Sun

A conductive fine particle, which is used for conductive connection between fine electrodes and tends not to give rise to a crack in the solder layer or disconnection caused by breakage in the connection interface between an electrode and the conductive fine particle even with a drop impact and the like, and tends not to have fatigue even after repetitive heating and cooling; an anisotropic conductive material obtained by using the conductive fine particle; and a conductive connection structure.

Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure

This invention provides a conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like. A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3&#xd7;10to 7&#xd7;10(1/K).

Conductive fine particles, method for plating fine particles, and substrate structural body

The purpose of the invention is to provide a method for producing conductive fine particles having a plating layer of extremely uniform thickness and free from scratches without being accompanied with agglomeration of fine particles to be plated during the plating process and a method for producing conductive fine particles comprising resin fine particles and a tin/silver alloy plating layer formed thereon. The invention is a method for producing a conductive fine particle, which comprises forming a plating layer on the surface of a fine particle to be plated using a barrel plating apparatus having a rotatable barrel in a plating bath, said method comprising putting the fine particle to be plated and a dummy particle with a lager particle diameter than that of the fine particle to be plated in the barrel and forming a plating layer while vibrating the barrel at an amplitude of 0.05 to 3.0 mm and a frequency of 20 to 120 Hz.

Method for producing electroconductive particles

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Shiga, Japan

Nobuyuki Okinaga