Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Hitachi, Ltd.

Mitsubishi Electric Corporation

Lg Energy Solution, Ltd.

Showa Denko Materials (america), Inc.

Nobuyuki Ogawa

Hiroshi Shimizu

Akishi Nakaso

Kenji Tanaka

Katsuyuki Masuda

Shunsuke Nagai

Hiroki Kuzuoka

Kenji Takaoka

Kenji Suzuki

Hikari Murai

Shin Takanezawa

Kazumasa Takeuchi

Katsuji Shibata

Masaharu Matsuura

Naoyuki Urasaki

Yasuyuki Mizuno

Yoshiyuki Tsuru

Takuya Nishimura

Shigeharu Arike

Kazuhito Kobayashi

Daisuke Fujimoto

Eisuke Haba

Kenji Takai

Kouichi Tsuyama

Norio Moriike

Hiroki Mikuni

Kazuhisa Otsuka

Hideyuki Ogawa

Hiroyuki Fukai

Toshihisa Kumakura

Takahiro Tanabe

Takako Ejiri

Yuma Gogyo

Norio Okano

Hiroaki Fujita

Hitoshi Onozeki

Katsunori Nishimura

Toyoki Ito

Kunihiko Akai

Shingo Kobayashi

Miyuki Muromachi

Provided is an electrolyte composition, comprising one or two or more polymers, oxide particles, at least one electrolyte salt selected from the group consisting of a lithium salt, a sodium salt, a calcium salt, and a magnesium salt, and a solvent, wherein structural units constituting the one or two or more polymers comprises a first structural unit selected from the group consisting of tetrafluoroethylene and vinylidene fluoride, and a second structural unit selected from the group consisting of hexafluoropropylene, acrylic acid, maleic acid, ethyl methacrylate, and methyl methacrylate, a content of the one or two or more polymers is more than 90% by mass based on a total amount of polymers in the electrolyte composition, and a mass ratio of a content of the first structural unit to a content of the second structural unit in the one or two or more polymers is 50/50 or more.

Electrolyte composition, secondary cell, and method for manufacturing electrolyte sheet

An optical semiconductor device includes an optical semiconductor chip in which at least one optical element is formed in a semiconductor substrate, and an extended wire pattern that is connected to a first electrode and a second electrode of the optical element and that extends outside the optical semiconductor chip. The first electrode and the second electrode of the optical semiconductor device are formed on the front surface side of the optical semiconductor chip, and the extended wire pattern is disposed on the front surface of the optical semiconductor chip or disposed at a position apart from the front surface.

Method for producing optical semiconductor device

A resin for an energy device electrode contains a structural unit derived from a nitrile group-containing monomer; and a structural unit derived from a monomer represented by the following Formula (I), wherein the resin does not contain a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group, or the resin has a ratio of a structural unit that is derived from a carboxy group-containing monomer and that contains a carboxy group of 0.01 moles or less with respect to 1 mole of the structural unit derived from a nitrile group-containing monomer, and a ratio of the structural unit derived from a nitrile group-containing monomer to a total of structural units derived from each monomer is from 90% by mole to less than 100%. 

Resin for energy device electrode, composition for forming energy device electrode, energy device electrode, and energy device

Provided is an interlayer insulating film for a multi-layered printed wiring board, including a wiring embedding layer (A) obtained by forming a thermosetting resin composition (I) into a layer, and an adhesion assisting layer (B) obtained by forming a thermosetting resin composition (II) into a layer, in which the interlayer insulating film contains a residual solvent in an amount of 1% to 10% by mass in a total amount of the wiring embedding layer (A) and the adhesion assisting layer (B), and the residual solvent contains an organic solvent having a boiling point of 150&#xb0; C. to 230&#xb0; C. in an amount of 10% by mass or more in a total amount of the residual solvent.

Interlayer insulating film and method for producing same

The disclosure provides a detecting composition or layer; a film, a device, a tape and a detecting system having the detecting layer; and methods of use thereof.

Detecting compositions and method of using same

An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order. The layer A is a resin composition which contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m/g or more, and the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) is within the range from 30:1 to 2:1. The layer B contains a thermosetting resin composition which is in a solid state at a temperature lower than 40&#xb0; C. but melts at a temperature of 40&#xb0; C. or higher but lower than 140&#xb0; C. Consequently, the adhesive film according to the present invention can solve problems in a laser process and a desmear removal process following the laser process and can form a conductor layer which has a high adhesion strength even on an interlayer insulating layer having a smooth surface-roughened state.

Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board

The present disclosure provides a binder resin composition comprising a polyolefin particle, an organic solvent and a polymer that is soluble in the organic solvent, as well as an electrode for a lithium ion secondary battery and a lithium ion secondary battery each using the binder resin composition.

Binder resin composition, electrode for lithium ion secondary battery and lithium ion secondary battery

The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet

Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 &#x3bc;m on a metal whose surface has a ten-point average roughness Rz of 2.0 &#x3bc;m or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.

Adhesion assisting agent fitted metal foil, and printed wiring board using thereof

An etching solution comprising (A) an amine as a solvent, (B) an alkali metal compound, and (C) an alcohol as a solvent, this etching solution being a non-aqueous solution. This etching solution is-effective for etching a cured epoxy resin layer for forming holes for interstitial via holes having a small diameter, in the production of a multilayer printed circuit board. This etching solution is particularly effective for etching a cured epoxy resin layer formed from a thermosetting epoxy resin composition including (a) an epoxy resin, (b) a crosslinking agent, and (c) a polyfunctional epoxy resin, which forms a thermosetting copper-clad adhesive resin sheet which covers an interlayer circuit plate of a multilayer printed circuit board.

Process for producing multilayer printed circuit boards

A process for producing a multilayer printed circuit board produced characterized by using a special thermosetting epoxy resin composition comprising (a) an epoxy resin, (b) a crosslinking agent and (c) a polyfunctional epoxy resin, for forming a thermosetting copper-clad adhesive resin sheet, which cover an interlayer circuit plate, followed by etching of cured adhesive resin for forming holes for interstitial via holes (IVH) having a small diameter using a special etching solution comprising (A) an amine as a solvent, (B) an alkali metal compound, and (C) an alcohol as a solvent, is suitable for mass production of multilayer printed circuit boards having IVH excellent in connection reliability and electrical properties.

A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

Process for producing multilayer printed circuit board for wire bonding

Growing community of inventors

Tokyo, Japan

Nobuyuki Ogawa