Rohm Co., Ltd.

Nobuyuki Nakamura

Kazunori Fuji

Yuji Sakamoto

Takashi Kawakami

Shinya Ohkubo

An apparatus is provided for making molded photointerrupters by using first and second leadframes. The first leadframe carries a plurality of light emitting devices, whereas the second leadframe carries a plurality of light receiving devices. The apparatus includes a molding unit which includes: a lower mold member which supports the first leadframe in a horizontal posture; an upper mold member movable vertically toward and away from the lower mold member; and a pair of side mold members movable laterally toward and away from each other between the upper and lower mold members, one of the respective side mold members supporting the second leadframe in a horizontal posture; wherein the respective mold members forms molding cavities when the mold is closed.

Method and apparatus for making molded photointerrupters

A method is provided for making molded photointerrupters by using first and second leadframes. The first leadframe carries a plurality of light emitting devices, whereas the second leadframe carries a plurality of light receiving devices. The apparatus used includes a molding unit which includes: a lower mold member which supports the first leadframe in a horizontal posture; an upper mold member movable vertically toward and away from the lower mold member; and a pair of side mold members movable laterally toward and away from each other between the upper and lower mold members, one of the respective side mold members supporting the second leadframe in a horizontal posture; wherein the respective mold members forms molding cavities when the mold is closed.

Method for making molded photointerrupters

The present invention provides a method of producing electronic components such as LED displays and hybrid IC's from a board supply frame. The frame comprises a parallel pair of elongate side bands, and a plurality of unit circuit boards integrally incorporated in the frame by means of connecting webs and arranged between the pair of side bands at a predetermined interval therealong. Various process steps such as chip bonding and wire bonding are performed with respect to the individual circuit boards while they are still in the frame. In a final step, each unit circuit board or electronic component is separated from the frame. The frame may be provided with an identification pattern to identify the type of unit circuit boards incorporated in the frame.

Cutting device for use in manufacturing electronic components

The present invention provides a method of producing electronic components such as LED displays and hybrid IC's from a broad supply frame. The frame comprises a parallel pair of elongate side bands, and a plurality of unit circuit boards integrally incorporated in the frame by means of connecting webs and arranged between the pair of side bands at a predetermined interval therealong. Various process steps such as chip bonding and wire bonding are performed with respect to the individual circuit boards while they are still in the frame. In a final step, each unit circuit board or electronic component is separated from the frame. The frame may be provided with an identification pattern to identify the type of unit circuit boards incorporated in the frame.

Growing community of inventors

Kyoto, Japan

Nobuyuki Nakamura