Matsushita Electric Works, Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Electric Works Co., Ltd.

Nobuyuki Miyagawa

Yuji Takada

Makoto Nishimura

Tsutomu Ichihara

Yoshimitsu Nakamura

Takao Miyai

Takanori Aketa

Takuya Matsumoto

Motoo Ikari

Hiroyuki Yagyu

Ryo Taniguchi

Yuichi Uchida

Tadahiro Yamaji

Masato Kawashima

Nobuyuki Asahi

Hiroaki Tachibana

Tomoaki Matsushima

Toshihiko Sato

Yutaka Kinugasa

Narimasa Iwamoto

Masashi Ishimaru

Makoto Saito

Makoto Nisimura

Kenichi Kimura

Hironori Kami

A microfluidic device includes a flow path through which a reaction solution flows, and an introducing portion for introducing the reaction solution into the flow path, wherein the flow path passes alternately and repeatedly several times through a first temperature region and a second temperature region having different predetermined temperatures, and the flow path includes the repeating unit portions passing through the first temperature region and the second temperature region, the repeating unit portions having decreasing lengths as the repeating unit portions are located farther away from the introducing portion.

Microfluidic device for reducing fluctuation in the solution feeding rate of a reaction solution

An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate) and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.

Optical module

In an optical attenuator, there are a first optical waveguideA connected to an input optical waveguide, a second optical waveguideB connected to an output optical waveguideand a connecting optical waveguide, which are connected with each other in series. A first recessA and a second recessB are formed in a positional relationship of opposite directions with respect to an axial direction of an optic axis of light that is inputted through the input optical waveguide, transmitted through the first optical waveguideA, the connecting optical waveguideand the second optical waveguideB and outputted from the output optical waveguide. Further, a first optical attenuating heaterA and a second optical attenuating heaterB are arranged so as to produce opposite refractive index distributions in the axial direction of the optic axis of the light that is inputted through the input optical waveguide, transmitted through the first optical waveguideA, the connecting optical waveguideand the second optical waveguideB and outputted from the output optical waveguide, in the first optical waveguideA and the second optical waveguideB. The optical attenuator capable of reducing a polarization dependent loss for a desired optical attenuation is provided without utilizing an interference of lights.

Optical attenuator

A method of producing plural device chips from a thin plate of a pyroelectric material comprises the following steps. First, plural device-forming regions each having an electrode and a circuit pattern for electrically connecting the electrodes are formed on each of front and rear surfaces of the thin plate to obtain a device substrate. By making an electrical connection between the circuit patterns, and grounding it, all of the device-forming regions on the device substrate are at the same potential. Next, a blast treatment is performed to the device substrate to remove a required region of the pyroelectric material, while leaving a bridge portion extending between adjacent device-forming regions and having the circuit patterns thereon, so that a device-chip aggregate is formed, in which adjacent device chips are coupled through the bridge portion. Subsequently, by removing the bridge portion, the device chip is separated from the device-chip aggregate.

Method of producing plural device chips from a thin plate of a pyroelectric material

An infrared ray receiving element includes a substrate made of a pyroelectric material and having at least one cantilever portion surrounded by a slit, in which at least a part of the cantilever portion in the substrate is uniformly polarized in the same direction and the remainder in the substrate includes a portion polarized at random. At least a pair of electrodes are respectively provided on a top surface and a bottom surface of the cantilever portion.

Infrared ray receiving element and infrared ray sensor using the same

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Takatsuki, Japan

Nobuyuki Miyagawa