Disco Corporation

Hitachi, Ltd.

Hitachi Consumer Electronics Co., Ltd.

Hitachi Maxell, Limited

Funai Electric Company Ltd.

Konica Minolta Business Technologies, Inc.

Samsung Electronics Co., Ltd.

Kyb Corporation

Maxell, Ltd.

Nobuyuki Kimura

Koji Hirata

Keiji Nomaru

Hidehiro Ikeda

Satoshi Nakayama

Tsutomu Nakashima

Hiroyuki Minemura

Tetsuya Nishida

Yumiko Anzai

Naoyuki Kofuji

Kazuo Shikita

Takayuki Nagase

Kohei Miyoshi

Jiro Yamamoto

Hiroyuki Gotou

Yuichiro Okamoto

Kazuma Yamazaki

Masahiko Yatsu

Hiroshi Morikazu

Satoshi Kobayashi

Kunio Sawai

Masaaki Takagi

Youngsuk Kim

Teruaki Sogawa

Futoshi Yamasaki

Shinro Inui

Taiki Sawabe

Takayuki Murakami

Byeong-hwan Jeon

Hideki Kume

Takashi Kakuda

Atsushi Ueki

Mitsuhiro Togashi

Koji Toyama

Kentaro Kato

Zhiwen Chen

Mitsunori Numata

Takuya Shiaki

Wook-rae Kim

Yuki Ikku

Kazuhiro Sasaki

Koichi Katayama

Katsuichi Inoue

Hisazumi Ishikawa

Katuyuki Yokota

Yuriko Inadachi

Noboru Yoshida

Yoshimasa Takeuchi

Kohei Hashimoto

Masaki Takada

Chie Ichikawa

Junya Murashita

Yasuhisa Watabe

Eiji Yamaguchi

Shigeru Takemura

Takehito Kawasumi

A pulse duration measuring apparatus includes a polarizing beam splitter for splitting a pulsed laser beam into a first laser beam and a second laser beam, a first mirror for reflecting the first laser beam traveling toward the polarizing beam splitter, a second mirror for reflecting the second laser beam traveling toward the polarizing beam splitter, a first quarter wavelength plate disposed between the polarizing beam splitter and the first mirror, a second quarter wavelength plate disposed between the polarizing beam splitter and the second mirror, an optical path length changing unit for moving the first mirror or the second mirror to change the length of the respective optical paths, a nonlinear crystal body for allowing a combined laser beam to pass therethrough, and a photodetector for measuring an optical intensity of the combined laser beam that has passed through the nonlinear crystal body.

Pulse duration measuring apparatus

An inspecting apparatus includes a table for supporting a workpiece thereon, a light applying unit for applying light to the workpiece supported on the table, and a light detector for detecting light reflected from the workpiece. The light detector includes a camera and a diffusion plate disposed between the table and the camera.

Inspecting apparatus

A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator that oscillates a laser, a Y-axis scanner that executes a high-speed scan with a laser beam emitted from the laser oscillator in a Y-axis direction, an X-axis scanner that executes processing feed of the laser beam emitted from the laser oscillator in an X-axis direction, and a beam condenser. The Y-axis scanner is selected from any of an AOD, a resonant scanner, and a polygon scanner and the X-axis scanner is selected from a galvano scanner and a resonant scanner.

Laser processing apparatus

A light irradiation apparatus that splits white light into light rays of a plurality of wavelengths to apply the light ray includes a white light source, a diffraction grating that splits white light emitted by the white light source into light rays of a plurality of wavelengths, and a light selector that selects a light ray of a specified wavelength from the light rays of the plurality of wavelengths split by the diffraction grating.

Light irradiation apparatus

A laser reflow apparatus reflows solder bumps disposed on a side of a semiconductor chip in a workpiece and included in an irradiation range on the workpiece by applying a laser beam to an opposite side of the semiconductor chip. The laser reflow apparatus includes a spatial beam modulation unit including a laser power density setting function to locally set the laser power density in the irradiation range of a laser beam emitted from a laser beam source, and an image focusing unit including an image focusing function to focus the laser beam emitted from the laser beam source and apply the focused laser beam to the irradiation range on the workpiece.

Laser reflow apparatus and laser reflow method

A measuring apparatus includes a holding unit and a measuring unit. The measuring unit includes a first optical fiber for transmitting light emitted from a light source, a branching member for branching the light transmitted through the first optical fiber to at least two measuring optical fibers, a plurality of heads including respective beam condensers for converging the light branched by the branching member onto a measurand, a shutter device for shifting timings of application of the light applied from the heads to the measurand, a second optical fiber branched from the branching member and transmitting returning light reflected from the measurand, a spectroscopic unit having a light detector for detecting the returning light, and a controller for controlling the shutter device to control the timings of application of the light applied from the heads to the measurand and controlling the light detector to detect the returning light individually.

Measuring apparatus

A measuring apparatus includes a holding table that holds a measurement-target object and a measuring unit that measures a height or a thickness of the measurement-target object held by the holding table. The measuring unit includes a light source unit, an optical fiber that guides light emitted by the light source unit, and a light collector that focuses the light guided by the optical fiber on the measurement-target object held by the holding table. The light source unit includes an excitation light source, a fluorescent body that emits fluorescence when receiving excitation light emitted by the excitation light source, and a collecting lens that focuses the excitation light emitted by the excitation light source on the fluorescent body.

Measuring apparatus that measures height position or thickness of measurement-target object

A thickness measuring apparatus that measures a thickness of a workpiece held by a chuck table. The thickness measuring apparatus includes plural image sensors that detect intensity of light spectrally split on each wavelength basis by plural diffraction gratings and generate a spectral interference waveform and a thickness output unit that outputs thickness information from the spectral interference waveform generated by the plural image sensors. The thickness output unit includes a reference waveform recording section in which spectral interference waveforms corresponding to plural thicknesses are recorded as reference waveforms and a thickness deciding section that compares plural spectral interference waveforms generated by the plural image sensors with the reference waveforms recorded in the reference waveform recording section and decides the thickness corresponding to each spectral interference waveform from the reference waveform that corresponds to the spectral interference waveform in the waveform shape.

Thickness measuring apparatus

A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator, a condenser lens that condenses a laser beam emitted from the laser oscillator, and a phase modulation element arranged between the laser oscillator and the condenser lens. Individual differences of the condenser lens are prevented by applying, to the phase modulation element, voltages corresponding to a combined pattern of a shape correction pattern which is configured to correct differences between an actual shape and design values of the condenser lens, and an adjustment pattern which is configured to adjust optical characteristics of the laser beam at each processing point.

Laser processing apparatus and adjustment method for laser processing apparatus

A spectral interference height detecting apparatus includes a chuck table for holding a workpiece thereon and a height detecting unit for detecting the height of an upper surface of the workpiece held on the chuck table. The height detecting unit includes a light source for emitting light in a predetermined wavelength band into a first optical path, a condenser disposed in the first optical path for converging light onto the workpiece held on the chuck table, a beam splitter disposed between the light source and the condenser for splitting the light in the first optical path into a second optical path, a mirror disposed in the second optical path to form a basic optical path length, for reflecting light into the second optical path and returning light through the beam splitter to the first optical path.

Height detecting apparatus and laser processing apparatus

A thickness measuring apparatus for measuring the thickness of a workpiece held on a chuck table includes the followings: a light source configured to emit white light; an optical branching unit configured to branch, to a second optical path, reflected light applied from the light source to the workpiece held on the chuck table via a first optical path and reflected from the workpiece; a diffraction grating disposed in the second optical path; an image sensor configured to detect an optical intensity signal of light separated into each wavelength by the diffraction grating; and a thickness output unit configured to generate a spectral interference waveform on the basis of the optical intensity signal detected by the image sensor, determine the thickness on the basis of the spectral interference waveform, and output the thickness.

A thickness measuring apparatus has a thickness measuring unit including a white light source, a diffracting mechanism that diffracts white light emitted from the white light source into diffracted light at time differences corresponding to the wavelengths of light components of the white light, a two-dimensional image sensor having a photodetection area that include a plurality of pixels for detecting return light reflected from upper and lower surfaces of a plate-shaped workpiece, a storage unit that stores, as a spectral interference waveform, intensities of the return light corresponding to the wavelengths of the light components successively received at the time differences by the pixels, and a waveform table recording therein a plurality of kinds of sample spectral interference waveforms corresponding to plate-shaped workpiece thicknesses.

A thickness measuring apparatus includes a white light source for emitting white light, a dispersing mechanism for producing time differences corresponding to the wavelengths of light components of the white light to thereby generate spectral light, the spectral light being applied to the workpiece and then reflected on the upper surface and the lower surface of the workpiece to obtain return light, a two-dimensional image sensor having a photodetecting area for detecting the return light, the photodetecting area including a plurality of pixels, a storing section for storing the intensity of the return light detected by the plural pixels according to wavelength with time difference, the intensity of the return light detected by each pixel being stored as a spectral interference waveform, and a thickness computing section for computing the thickness of the workpiece from the spectral interference waveform stored in the storing section.

A thickness measuring apparatus including a thickness measuring unit for measuring the thickness of a plate-shaped workpiece. The thickness measuring unit includes a white light source for emitting white light, a dispersing mechanism for producing time differences corresponding to wavelengths of light components of the white light to thereby generate spectral light, a two-dimensional image sensor having a photodetecting area for detecting the return light, the photodetecting area including a plurality of pixels, a storing section for storing the intensity of the return light detected by the plural pixels according to wavelength with time difference, a waveform table previously storing a plurality of kinds of sample spectral interference waveforms respectively corresponding to different thicknesses of the workpiece, and a thickness deciding section for deciding the thickness at an X-Y coordinate position in a two-dimensional area of the workpiece.

A thickness measuring apparatus for measuring a thickness of a wafer includes a light source emitting light having a transmission wavelength region to the wafer, a focusing unit applying the light emitted from the light source to the wafer held on a chuck table, an optical branching section branching the light reflected on the wafer held on the chuck table, a diffraction grating diffracting the reflected light branched by the optical branching section to obtain diffracted light of different wavelengths, an image sensor detecting an intensity of the diffracted light obtained by the diffraction grating to produce a spectral interference waveform, and a computing unit computing the spectral interference waveform produced by the image sensor to output thickness information.

Interferometric thickness measuring apparatus using multiple light sources coupled with a selecting means

Growing community of inventors

Yokohama, Japan

Nobuyuki Kimura