Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Nobuyuki Kakita

Akira Kabeshita

Osamu Okuda

Hiroshi Uchiyama

Naoto Mimura

Kazunori Kanai

Satoshi Adachi

Shinjiro Tsuji

Takashi Yazawa

Hirofumi Obara

Atsushi Tanabe

Akira Kameda

Shingo Yamada

Yoichi Tanaka

Takahiro Kurokawa

Masahiro Morimoto

Izumi Miura

Masaki Kishimoto

A tray supplier which performs supplying and collecting of trays includes a supply-side tray storage unit, a collection-side tray storage unit, a first tray placer and a second tray placer on which the trays are placed, and a first placer mover and a second placer mover which respectively move the tray placers between the supply-side tray storage unit and the collection-side tray storage unit, in which a first movement shaft of the first placer mover and a second movement shaft of the second placer mover are disposed parallel to each other, lifting and lowering units which lift or lower the first tray placer and the second tray placer are provided, and interference between the placer movers does not occur.

Tray supplier and tray supply method

A component mounting line includes a first and a second component mounting devices. The first component mounting device adheres anisotropic conductive members to a region of a part of one side and a region of the other side of the substrate, temporarily crimps electronic components onto the region of the part of the one side and the region of the other side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the other side. The second component mounting device adheres the anisotropic conductive members to remaining regions of the one side of the substrate, temporarily crimps the electronic components onto the remaining regions of the one side to which the anisotropic conductive members are adhered, and mainly crimps the electronic components onto the region of the part of the one side and the remaining regions of the one side.

Component mounting line and component mounting method

Link mechanisms provided corresponding to press bonding heads each include a first link member having one end pivotably connected to an upper end of the press bonding head, a second link member having one end pivotably connected to the other end of the first link member and having the other end pivotably connected to a link bracket above the press bonding head, and a connection slide part connected to a connection part between the first and second link members, collectively drive the connection slide parts of the link mechanisms by a press bonding head driving unit in horizontal directions (Y axis directions) orthogonal to a direction (X axis direction) of side-by-side arrangement of the plurality of press bonding heads, open and close the first and second link members of the link mechanisms in the vertical directions thereby collectively moving the plurality of press bonding heads downward and upward.

Component press bonding apparatus and method

A magazine is provided with two opening portions that enable insertion and extraction of a tray and are approximately orthogonal to each other, and a regulation portion for regulating insertion and extraction of the tray from the opening portions. A tray component feeding device has a loading port for loading the magazine thereinto, and an extraction port for extracting a tray plate of the magazine, which are approximately orthogonal to each other. Further, a component mounting device is provided with the tray component feeding device loaded with the magazine on a lateral side of the component mounting device to which a transfer conveyor for transferring a circuit board extends.

Magazine, tray component feeding device, and component mounting device

An apparatus and a method for mounting electronic components are provided which shorten a cycle time required for mounting and enable a component mounting machine to be arranged in a small area. There is provided a controller, so that a retreat control for a second electronic component is performed to a second component feeder so as to avoid an interference if a first electronic component or a component holder interferes with the second electronic component of the second component feeder because of movement of a mounting head. The time conventionally required for moving up and down a component holder can be reduced, and moreover the need of uselessly moving along a detour at a time of moving the mounting head is eliminated. The cycle time can be shortened, and eventually costs can be reduced.

Electronic component mounting apparatus and method

Disclosed are a component recognizing method and apparatus, and a component mounting method and apparatus, by which components with various heights held by a plurality of nozzles can be recognized continuously. The drive of a head is transmitted to nozzles, with surfaces to be recognized of components being controlled so as to be positioned in a recognizable range during respective recognizing operations of the components, and a continuous recognition is thereby made possible. The adjustment of heights of the surfaces to be recognized during the recognizing operations of the components is achieved by one drive unit and a plurality of drive transmitting units.

Component recognizing method and apparatus, and component mounting method and apparatus

Growing community of inventors

Yamanashi, Japan

Nobuyuki Kakita