Kyocera Corporation

Nobuyuki Ito

Shin Matsuda

Shigenobu Nakamura

Takeshi Okamura

Masanobu Ishida

Tomohiro Kawamoto

Takafumi Tsurumaru

Tsuyoshi Setoguchi

Kazuhiro Kawabata

Keiko Higashi

Hitomi Imamura

A ceramic member in which the metal layers with high void ratio are sufficiently sintered to lower a residue of resin is produced. The method for manufacturing a ceramic member which comprises a step of forming a stacked compact from a plurality of metallic paste layers containing a metal component Mthat are stacked one on another via ceramic green sheets, and a step of firing the stacked compact, wherein at least one of plural metallic paste layers is formed as a second metallic paste layer that has the mass percentage X higher than that of the metallic paste layer that adjoin therewith in the stacking direction and a ceramic powder is contained in the second metallic paste layer in the step of forming the stacked compact, the mass percentage X being the proportion of the metal component Mto the total metal content in the metallic paste layer.

Method for manufacturing ceramic member, and ceramic member, gas sensor device, fuel cell device, filter device, multi-layer piezoelectric device, injection apparatus and fuel injection system

A package for housing a semiconductor element includes a substrate of electrically insulating material and having a semiconductor element-mounting portion at an upper surface thereof onto which the semiconductor element is mounted. The substrate has a plurality of depression portions at a lower surface thereof, and a plurality of metallized wiring layers lead out from the periphery of the semiconductor element-mounting portion and extend to the bottom surfaces of the depression portions. A plurality of connection pads formed on the bottom surfaces of the depression portions are electrically connected to the metallized wiring layers. Terminals which are attached to the connection pads each have a ball-like protruding portion at the lower surface of the insulating substrate and comprise non-eutectic solder. The package may be provided with metallic pads formed on the lower surface of the insulating substrate, and metallic balls attached to the metallic pads.

Package for a semiconductor element having depressions containing solder terminals

A package for housing semiconductor elements including an insulating base which consists of electrical insulation material, and has a mounting portion that mounts semiconductor elements on the upper surface as well as a plurality of depressions on either of the upper surface and the lower surface thereof, a plurality of metallized wiring layers led away from the periphery of the mounting portion and extending to one end surface of the depressions, a plurality of connection pads for electrically connecting the metallized wiring layers formed on the end surface of the depressions of the insulating base and terminals which are soldered to the connection pads, wherein the terminals are accurately attached by solder to designated positions on the connection pads and securely and strongly joined to designated wire conductors of external electronic circuit boards to achieve reliable electrical connections of semiconductor integrated circuit elements housed inside the package to external electronic circuit boards.

Package for housing semiconductor elements

Disclosed is an aluminium nitride sintered body composed of a sintered body of aluminum nitride, erubium (Er) metal or its compound and calcium (Ca) metal or its compounds, said sintered body containing 1.8 to 10% by weight of an erubium component calculated as an oxide and more than 0 to not more than 2% by weight of a calcium component calculated as an oxide, and consisting of crystal grains of aluminum nitride and an intergranular phase composed mainly of an aluminate other than Er.sub.3 Al.sub.5 O.sub.12, said sintered body further having a bulk density of 3.2 to 3.6 g/cm.sup.3.

Aluminum nitride sintered body

Growing community of inventors

Kirishima, Japan

Nobuyuki Ito