Fuji Corporation

Fuji Machine Mfg. Co., Ltd.

Nobuyuki Ishikawa

Katsunori Tanaka

Noriaki Iwaki

Mitsuhiro Nishibori

A calculation device for a work machine comprising a holding head including a holding tool configured to hold a lead component comprising a lead and a body and a moving device configured to move the holding head, the calculation device calculating a release position of the lead component held by the holding tool, when the work machine mounts the lead component on a board by inserting the lead of the lead component held by the holding tool into a hole formed on the board by operating the moving device.

Calculation device

A lead component mounting method includes: a component insertion process in which two lead wires are inserted into two corresponding through-holes which are formed in a circuit board from one side of the circuit board in a state in which at least a pair of pawl portions pinches and holds each of the two lead wires which are included in a lead component; and a clinching process in which protruding portions, which are portions protruding from another side of the circuit board, of the two lead wires which are inserted into the two corresponding through-holes, are bent in a state in which the two lead wires are held by at least the pair of pawl portions.

Lead component clinching and mounting method

A component determination device and a component determination method for an electronic component, the component including a reference section formed as a different member to the multiple electrodes. The component determination device includes: a measuring device configured to measure positions of multiple reference points set on the reference section and a position of a measurement point set on each of the multiple electrodes; a plane calculating section configured to calculate a reference plane representing a position of the upper surface of the circuit board with respect to the component main body when the electronic component is mounted on the circuit board based on the positions of the multiple reference points; and a suitability determining section configured to determine whether the electronic component is suitable based on a distance between the reference plane and the multiple measurement points.

Component determination device and component determination method

A cut and clinch device that bends leads of a leaded component into at least one of an bent-in state, a bent-out state, or an N-bent state. The bent-in state is a state with a pair of leads bent inside by moving a pair of movable sections towards each other. The bent-out state is a state with a pair of leads bent outside by moving a pair of movable sections away from each other. The N-bent state is a state with a pair of leads bent into an N-shape by moving a pair of slide bodies towards each other, moving a pair of movable sections away from each other, and then rotating the pair of slide bodies around a center point. Thus, leads can be bent into various states, and a leaded component can be appropriately mounted on a board.

Cutting and bending device

A CPU of a controller of a mounting device determines an aperture and a light exposure time so that tip portion falls within the depth of field (DOF) of component camera based on information about the height of tip portion which is an imaging target portion in component and controls component camera so as to image the component with the determined aperture and light exposure time.

Mounting device

A lead component mounting machine is provided in which lead wires are pinched and held from both sides by a pair of pawl portions, and the lead wires are inserted into through-holes of a board. The holding by the pawl portions is loosened, and a component main body is pushed in by a pushing-in device until the component main body comes into contact with the pawl portions. Subsequently, the strength of the holding by the pawl portions is increased, and the cutting and clinching of the lead wires is performed. Sliding movement of the lead wires is in a state of being suppressed by the pawl portions.

Lead component mounting machine and lead component mounting method

Solder housed in flow tankis ejected from nozzleby a pump provided inside flow tank. Jet motorthat drives the pump is provided outside flow tank, and cooling deviceis provided between flow tankand jet motor. Cooling deviceincludes cooling pipethat is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe, flows along cooling pipe, and flows out of a lower end of cooling pipeso as to be supplied to flow tank. The temperature of the nitrogen gas increases due to heat dissipated from jet motor, thus lowering the temperature of jet motor. Heat is transferred from jet motorto the nitrogen gas, and jet motoris cooled satisfactorily.

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Nagoya, Japan

Nobuyuki Ishikawa