Mitsubishi Gas Chemical Company, Inc.

Nobuyuki Ikeguchi

Morio Gaku

Hidenori Kimbara

Yoshihiro Kato

Toshihiko Kobayashi

Yasuo Tanaka

Katsuji Komatsu

Yasunori Osaki

Kenji Ishii

Yasunari Osaki

Satoshi Ayano

Takabumi Omori

Nobuyuki Yamane

Toru Harada

Daisuke Ohno

Hidenori Kinbara

Takuya Hasaki

Shinya Komatsu

Mitsuo Ejiri

Masakazu Motegi

Taro Yoshida

Yukiya Masuda

Masahiro Shimoda

Morio Mori

Hiroki Aoto

Akira Katata

Kanzi Ishikawa

Yoshiyuki Furuya

A lubricant sheet suitable for use in a process of drilling a laminate or a plastic board, comprising a metal foil or an organic film, and a lubricant resin composition layer or a primer layer and the lubricant resin composition layer, the lubricant resin composition layer or the primer layer and the lubricant resin composition layer being formed on at least one surface of the metal foil or the organic film, wherein at least one layer of the primer layer and the lubricant resin composition layer contains a colorant, and a drilling method using the above lubricant sheet.

Lubricant sheet for drilling and method of drilling

A copper-clad laminate of a highly-elastic glass fabric base material/thermosetting resin formed of prepreg obtained by impregnating a glass fabric base material made of a glass woven fabric having a thickness of 25 to 150 &#x3bc;m, a weight of 15 to 165 g/mand a gas permeability of 1 to 20 cm/cm/sec. with a thermosetting resin composition and drying it.

Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity

The present invention relates to a heat-resistant film base-material-inserted B-stage resin composition sheet for producing a multilayer printed wiring board which is excellent in copper adhesive strength, heat resistance and insulating reliability particularly in the Z direction and is suitable for use, as a high density small printed wiring board, in a semiconductor-chip-mounting, small-sized and lightweight novel semiconductor plastic package, and to a use thereof.

Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof

A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900&deg; C. and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97% by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900&deg; C. and a bond energy of at least 300 KJ/mol.

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

A copper-clad board suitable for making a hole with a carbon dioxide gas laser, which copper-clad board is obtained by disposing a double-side-treated copper foil provided with a metallic-treatment layer having a high absorption rate of a carbon dioxide gas laser energy on at least one surface, at least on an outer layer of a thermosetting resin composition layer such that the metallic-treatment layer is formed on a shiny surface of the copper foil which shiny surface is to be a surface layer, and laminate-forming the double-side-treated copper foil and the thermosetting resin composition layer under heat and pressure, to make an alloy of the metallic-treatment layer and the copper by the above heating, a method of making hole in the above copper-clad board and a printed wiring board comprising the above copper-clad board.

Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board

A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board. The metal sheet is insulated from front and reverse circuit conductors with a heat-resistant resin composition, and the metal sheet is provided with a clearance hole having a diameter greater than a diameter of each of at least two through holes. The through-holes are provided in the clearance hole, and a through-hole or through-holes are insulated from the metal sheet with a resin composition, with at least one through-hole being connected to the metal sheet. One surface of the metal sheet is provided with at least one protrusion portion which is of the same size as the semiconductor chip and exposed on a surface, and the semiconductor chip is fixed on the protrusion portion.

Semiconductor plastic package and process for the production thereof

A method of making a high-density copper-clad multi-layered printed wiring board having a reliable through hole including providing a stacked assembly including three copper foil layers and at least two resin layers; providing an auxiliary material on a top surface of the stacked assembly and providing a backup sheet on a bottom surface of the stacked assembly to form an assembly; subjecting the top surface of the assembly to pulsed oscillation from a carbon dioxide laser to form at least one through-hole to produce a pulsed assembly; reducing the thickness of the front and reverse copper foil layers and simultaneously with reducing, removing copper foil burrs, to produce a cleaned assembly; and plating the cleaned assembly with copper to produce the high-density copper-clad multi-layered printed wiring board.

Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole

Photosensitive resin composition

A high relative-permittivity B-staged sheet obtained by incorporating an insulating inorganic filler having a relative permittivity of at least 500 at room temperature into a solvent-less resin component so as to have an insultaing inorganic filler content of 80 to 99% by weight, a high relative-permittivity prepreg obtained from the above high relative-permittivity B-staged sheet, a process for the production of the high relative-permittivity prepreg, and a printed wiring board obtained from any one of the above high relative-permittivity B-staged sheet and the high relative-permittivity prepreg.

High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these

A resist composition for permanent protective coating of a printed wiring board, which resist composition is excellent in flame resistance and is obtained by incorporating as essential components a flame retardant containing 100 to 140 parts by weight of (a) aluminum hydroxide, 0.1 to 15 parts by weight of (b) a molybdenum compound and 0.1 to 10 parts by weight of (c) a zinc stannate type compound into 100 parts by weight of a resin.

Resist composition excellent in flame resistance

Provided is a printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package, the distortion of the printed wiring board is decreased and the distortion of a semiconductor package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased. The printed wiring board has, as a substrate for a chip scale package, a double-side copper-clad laminate formed of an insulation layer and having copper foils on both surfaces, wherein the double-side copper-clad laminate has an upper copper foil surface and a lower copper foil surface, the upper copper foil surface has a wire bonding or flip chip bonding terminal and has a copper pad in a position where the copper pad can be electrically connected to said wire bonding or flip chip bonding terminal and can be connected to a blind via hole formed in the lower copper surface, the lower copper foil surface has a solder-balls fixing pad in a position corresponding to said copper pad, the solder-balls-fixing pad has at least 2 blind via holes within itself, and the solder-balls-fixing pad connected to a reverse surface of the copper pad with a conductive material is electrically connected with solder balls which are melted and filled in blind via holes so as to be mounded.

Printed wiring board for semiconductor plastic package

A printed wiring board for a ball grid array type semiconductor plastic package which has excellent heat diffusibility and causes no popcorn phenomenon, and a metal-plate-inserted printed wiring board having wire bonding pads formed at two levels, for use in the ball grid array type semiconductor plastic package.

Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board

Printed wiring board for a chip size scale package, which overcomes the poor adhesion of solder balls to a base material which poor adhesion is caused by a recent decrease in the size of the solder balls, and in the chip size scale package. The distortion of the printed wiring board is decreased and the distortion of a semiconductor plastic package formed by mounting a semiconductor chip on the printed wiring board by wire bonding or flip chip bonding is decreased. The board has at least two blind via holes in one solder-balls-fixing pad.

Disclosed is a semiconductor plastic package having a structure in which a metal sheet having a size nearly equivalent to a printed wiring board is disposed nearly in the central portion in the thickness direction of the printed wiring board. The metal sheet and a signal propagation conductive circuit on a front surface of the printed wiring board are insulated from each other with a thermosetting resin composition. The conductive circuit on the printed wiring board surface is connected to a conductive circuit formed on an opposite surface of the printed wiring board, or to a conductive circuit pad formed for being connected with solder balls with a conductive through hole. A semiconductor chip, wire and bonding pad are encapsulated with a resin. The semiconductor plastic package has at least one blind via hole made in the opposite surface so as to be directly connected to the metal sheet. The blind via hole has an inner wall rendered thermally conductive. The printed wiring board is provided, on the semiconductor-chip-mounting side, with an elevated metal portion, a plurality of metal protrusions each having the form of a frustum of a pyramid or a cone, or at least one via hole having an inner wall rendered thermally conductive. A process for the production of a printed wiring board used for the above plastic package is also disclosed.

Growing community of inventors

Tokyo, Japan

Nobuyuki Ikeguchi