Shinkawa Ltd.

Kabushiki Kaisha Shinkawa

Nobuyuki Aoyagi

Kohei Seyama

Tadayuki Ueda

Hisashi Ueda

Hikaru Miura

Takuya Asami

Tohru Takamura

Mitsuaki Sakakura

Noboru Fujino

Hiroaki Yoshino

Shigeru Amemiya

Yusuke Maruya

Yuhei Ito

Yasumoto Togashi

Masaki Ohkawara

An ultrasonic horn () includes: a vibration source part () to which an ultrasonic vibrator () is mounted; a tip end part () to which a capillary () is mounted; and an intermediate part () which is interposed between the tip end part () and the vibration source part () and propagates vibration generated by the ultrasonic vibrator () to the tip end part (). The intermediate part () is formed with a single spiral hole () which is a hole penetrating in a radial direction of the ultrasonic horn () and advances in an axial direction as the spiral hole advances in a circumferential direction.

Ultrasonic horn and manufacturing apparatus of semiconductor device

The present invention includes: an ultrasonic horn () to which two ultrasonic vibrations can be input to excite a capillary () mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit () which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn () extends. The control unit () adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (&#x394;Y/&#x394;X) of amplitude of the capillary () in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.

Wire bonding apparatus

An ultrasonic horn is provided with: a vibration generating unit configured to generate longitudinal vibration having a frequency in the ultrasonic band on the basis of a signal having a frequency in the ultrasonic band input from an oscillator; a vibration amplifying unit configured to amplify the vibration generating unit while transmitting the longitudinal vibration from the vibration generating unit; and a longitudinal-torsional vibration conversion slit unit having slits formed in a groove-like shape on the surfaces of the vibration amplifying unit and configured to convert the longitudinal vibration into torsional vibration. The vibration amplifying unit has a polygonal shape in a plane view, and has a plurality of surfaces provided with slits along with a surface not provided with slits.

Ultrasonic horn

A bonding apparatus includes an ultrasonic horn configured to vibrate longitudinally in resonance with the vibration of an ultrasonic vibrator; a capillary attached at an anti-node of the vibration of the ultrasonic horn; a flange provided at a node of the vibration of the ultrasonic horn; a bonding arm; a load sensor attached between the center of rotation of the bonding arm and a flange mounting surface; and a vibration load detection unit for extracting a signal obtained by causing a signal that is detected with the load sensor to pass a signal within a frequency range around the vibrational frequency of the ultrasonic vibrator through a band-pass filter, whereby the bonding apparatus can detect the vibration load at a tip end of the capillary in the direction along the central axis of the ultrasonic horn with a simple structure.

Bonding apparatus

Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus, a capillaryis lowered to a bonding position to bond an initial ballto a padon an overhanging die. Here, a position of the capillaryin a Z direction and a load detected by a load sensorare detected and stored every predetermined time period. A load change point is detected by referring to the stored load and the stored position. By subtracting the bonding position from a load changing position of the capillaryat the load change point, a movement amount Z of the capillaryfrom the load changing position to the bonding position is calculated. After the capillaryis lifted by the movement amount Z, a wire loop is formed between the padand a lead

Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same

In a first bonding step of bonding an initial ball to a pad surface, the initial ball is applied by ultrasonic vibration while in pressure contact with the pad surface and a capillary undergoes a scrubbing motion to be rotated spirally. This allows a deformation area of the initial ball to be reduced, whereby the accuracy of bonding can be improved. In a second bonding step of bonding a bonding wire to a lead surface, the capillary and the bonding wire are applied by ultrasonic vibration while in pressure contact with the lead surface and the capillary undergoes a scrubbing motion to be rotated spirally. This allows the bonding wire bonded to the lead surface to be cut reliably.

Method of manufacturing semiconductor device, and bonding apparatus

An apparatus for pass/fail determination of bonding used in a bonding apparatus, includes: an ultrasonic horn configured to vibrate longitudinally in resonance with the vibration of an ultrasonic vibrator; a capillary attached at an anti-node of the vibration of the ultrasonic horn; a flange provided at a node of the vibration of the ultrasonic horn; a bonding arm; and a load sensor attached between the center of rotation of the bonding arm and a flange mounting surface in an offset manner from a longitudinal central axis of the ultrasonic horn, in which a load on the capillary in the direction toward and away from the bonding target is continuously detected by using the load sensor during bonding operation and the maximum value of the detected load is defined as an impact load to determine pass/fail of the bonding based on the impact load, thereby allowing a mid-bonding pass/fail determination.

Method and apparatus for pass/fail determination of bonding and bonding apparatus

In a method for detecting and picking up dies from a wafer, when a defective die is detected inside a predetermined reversing range defined on the wafer, the die detection and pick-up movement is shifted one pitch to the next row of dies so as to detect the first die of the next row. If the first die of the next row is not a defective die, the die detection and pick-up movement proceeds toward the edge of the wafer in the X direction and successively detects and picks up dies on that row. Then, when a defective die is detected on that row, the direction of the die detection and pick-up movement is reversed without picking up the defective die, so that the die located immediately at the inner side of the first die of that row is detected and picked up, and non-defective dies on that row are successively detected and picked up. If the first die on the next row described above is a defective die, then the die detection and pick-up movement proceeds in the reverse direction so that the dies on the that row are successively detected and picked up as long as they are not defective dies.

Wafer die pick-up method

A conveyor apparatus for a plate form article such as a lead frame including a main conveyor line and a working conveyor line for conveying the lead frame in a direction parallel to the length wise direction of the lead frame, and a sub-conveyor which transfers the lead frame to and from the main and working conveyor lines in a direction perpendicular to the conveyor lines, and the sub-conveyor being made of work-holders for holding the lead frame in such a manner that two ends of the length-wise direction of the lead frame are positioned perpendicular to the conveying direction of the sub-conveyor, a vertical driving cylinder for raising and lowering the work-holders, and a conveying mechanism, which includes a motor 61, timing belts, etc., for moving the work-holders in a direction perpendicular to the conveyor lines. Thus, a smooth conveyance of the lead frame by the sub conveyor is insured even though the lead frame has projected portions that are called 'islands.'

Apparatus for conveying plate-form articles

A conveyor apparatus for a plate form article such as a lead frame including: a main conveyor line and a working conveyor line, which convey the lead frame in a direction parallel to the length-wise direction of the lead frame; a sub-conveyor which transfers the lead frame between the main and working conveyor lines in a direction perpendicular to such conveyor lines, the sub-conveyor being made of work-holders for holding the lead frame in such a manner that two ends of the length-wise direction of the lead frame are positioned perpendicular to the conveying direction of the sub-conveyor and supported by the work-holders; a vertical driving cylinder for raising and lowering the work-holders; belt conveyor systems of two different linkages which are connected to the work-holders; and a motor which drives the timing belt systems. Both timing belt system are linked to and driven by the motor, but one of them is driven through the braking and clutch mechanisms. Thus, by way of switching on and off the brake and clutch mechanisms, not only the conveyance of the lead frame but also the width adjustment between the work-holders are accomplished by a single power source which is the motor; in addition, a smooth conveyance of the lead frame by the sub-conveyor is insured.

A method for monitoring conditions of printing plates in a marking device which uses relief-plate printing. The method employs a camera installed beneath a movable printing plate so that the condition of the printing plate is checked via the camera. A device utilizing such a method includes a plate holder to which the printing plate is attached, an X-Y-Z driver which moves the plate holder in X, Y and Z directions, a camera installed with its photographing side facing up and positioned away from a workpiece carrying table which positions and carries a workpiece that is to be printed, an image processor which processes image signals from the camera, and a monitor which displays images in accordance with the output of the image processor. Thus, the printing plate is photographed by the camera and its condition is checked.

Growing community of inventors

Tokyo, Japan

Nobuyuki Aoyagi