Fujitsu Corporation

Nobuyoshi Yamaoka

Akira Ueda

Masahiro Suzuki

Tadashi Katsui

Junichi Ishimine

Yasushi Uraki

Seiichi Saito

Yuji Ohba

Ikuro Nagamatsu

Masao Kondo

Tetsuyuki Kubota

Akihiko Fujisaki

Kenichiro Aoki

Atsushi Furuya

Tomoko Kutsuzawa

Toshiyuki Nakada

Keishi Shimizu

Kouichi Shimizu

Sayoko Tominaga

An air conditioning control apparatus for controlling an air conditioner in a room which accommodates a computer, includes obtaining repetitively a detected value of a total power consumption of the computer and the air conditioner and a detected value of a air temperature at the air inlet, storing the obtained values into a memory, determining an approximate expression representing a relation between the total power consumption and the air temperature on the basis of the values stored into the memory, determining a value of the air temperature corresponding to the lowest value of the total power consumption, by using the calculated approximate expression, and controlling the air conditioner so that the air temperature become equal the calculated air temperature.

Air conditioning control apparatus and air conditioning control method

An installation for cooling an electronic device includes an air conditioner having an air outlet for blowing cooling air to a room; a first detector adjacent to the air outlet of the air conditioner, for detecting a temperature of the cooling air; a rack accommodating the electronic device, the rack having an air inlet for receiving the cooling air from the air conditioner and an air outlet for exhausting air to the room; a second detector adjacent to the air inlet of the rack, for detecting a temperature of air received through the air inlet of the rack; and a controller for acquiring the temperatures detected by the first and the second detectors, and controlling a quantity of the cooling air blown from the air outlet of the air conditioner so as to decrease a difference between the temperatures detected by the first and the second detectors.

Air conditioning installation and control method

An apparatus for controlling grille aperture ratios of a plurality of air transfer grilles which are installed in a room, includes a determining unit for determining target grille air volumes of air blowing to the racks, for determining simulation air volumes of air blowing from the air transfer grilles on the basis of the target grille air volumes so that each of air of the target grille air volumes are blown to the racks, and for determining grille aperture ratios for each of the air transfer grilles on the basis of the plurality of simulation air volumes so that each of the amounts of air blowing from the air transfer grilles is replaced by each of the simulation air volumes, and a controller for controlling each of the grille aperture ratios of the air transfer grilles on the basis of each of the determined grille aperture ratios.

Apparatus and method for controlling grille aperture ratios of a plurality of air transfer grilles

A thermal-fluid-simulation analyzing apparatus includes an execution unit that generates an analysis model using analysis conditions to conduct a first thermal fluid simulation analysis based on the generated analysis model, an analysis-condition collecting unit that collects analysis conditions when a predetermined period passes after the first thermal fluid simulation analysis, a condition extracting unit that extracts a boundary condition from the analysis conditions collected by the analysis-condition collecting unit, and a re-execution unit that selects a region corresponding to the boundary condition extracted by the condition extracting unit from regions of the analysis model generated by the execution unit, updates the selected region with the boundary condition, and conducts a second thermal fluid simulation analysis for the updated analysis model.

Thermal-fluid-simulation analyzing apparatus

There are included a location-information management unit that manages location information of devices arranged in a spatial layout on a screen, a device-feature management unit that manages device features of the devices, a guide-information generation unit that reads the location information and the device features of the devices arranged in the spatial layout from the location-information management unit and the device-feature management unit respectively and generates device-layout guide information allowing for the device features of the devices based on the read location information and device features of the devices, and a monitor unit that guides and displays the device-layout guide information generated by the guide-information generation unit.

Device-layout guiding apparatus and device-layout guiding method

A job assigning apparatus connected to a plurality of arithmetic units for assigning a job to each of the arithmetic units, the job assigning apparatus includes a power consumption acquiring processor for acquiring power consumptions with respect to each of the arithmetic units, a selector for selecting one of the arithmetic units as a submission destination in increasing order of the power consumptions acquired by the power consumption acquiring processor, and a job submitting processor for submitting a job to the submission destination.

Job assigning apparatus and job assignment method

An air condition control device for controlling a plurality of air conditioners which cool a plurality of electronic apparatuses respectively, the air condition control device includes a storage section for storing a heating value information related to respective heating values of the electronic apparatuses, and a controller for detecting that a fault has occurred in one of the air conditioners, specifying any of the electronic apparatuses which has been cooled by the one of the air conditioners having occurred the fault when the fault in the one of the air conditioners is detected, determining a heating value of each of the specified electronic apparatuses on the basis of the heating value information, and setting the air flow rate for at least one of the other air conditioners in accordance with the heating values of the specified electronic apparatuses.

Air condition control device and controlling method

A magnet unit for a magnetron sputtering system includes a base plate and a plurality of magnet parts each including a first magnet and a first supporting member. The first supporting member supports the first magnet and fixes the first magnet to the base plate. The magnet parts confine a plasma.

Magnet unit for magnetron sputtering system

A head slider is related to an actuator block. A flexible printed circuit board is received on the surface of the actuator block. A head IC is mounted on the surface of the flexible printed circuit board. A heat conductive member is mounted on the head IC. The heat resistance of the heat conductive member is set smaller than that of the flexible printed circuit board. A larger amount of heat can be transmitted from the head IC to the actuator block. The actuator block is made of a metal material such as aluminum. The heat resistance of the actuator block is apparently smaller than that of the flexible printed circuit board. A larger amount of heat can be radiated from the actuator block as compared with the flexible printed circuit board. The head IC is thus reliably prevented from a rise in the temperature.

Recording medium drive

A suspension is made of a suspension body of a stainless plate, a resin protective layer on one surface of the suspension body, a circuit pattern including read wiring and write wiring on the protective layer, and a metal layer provided on the other surface of the suspension body. In this arrangement, heat deformation of the suspension is alleviated when a write current is applied.

Head suspension having reduced heat deformation

The present invention relates to a reflow furnace for heating a carried circuit module to perform reflow soldering. The reflow furnace has a nozzle for performing an operation of spraying the inert gas on a soldering portion for the circuit module carried into the furnace while the nozzle is moved, maintaining high mounting reliability and high productivity, even if apertures of the carrying inlet and the carrying outlet are large.

Reflow furnace

A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor element on the substrate. For the carrying direction in the reflow furnace using a carrying belt, temperature analysis for time duration is performed for the solder bumps at both the front and rear, and then the condition of the reflow furnace is determined so as to close at both the times for reaching the solder melting temperature and the times for maintaining the solder melting temperature.

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Kawasaki, Japan

Nobuyoshi Yamaoka