Dowa Mining Co., Ltd.

Nobuyoshi Tsukaguchi

Masami Kimura

Takayuki Takahashi

Yukihiro Kitamura

Makoto Namioka

Michihiro Kosaka

Masahiko Wada

Jyunji Nakamura

After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus lines of the alloy to bond the metal member directly to the ceramic substrate.

Metal/ceramic bonding article and method for producing same

A metal layerof aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate, and a resisthaving a predetermined shape is formed on the metal layer. Then, an etchant of a mixed solution prepared by mixing ferric chloride with water without adding any acids is used for etching and removing an undesired portion of the metal layerto form a metal circuiton the at least one side of the ceramic substrate

Metal/ceramic circuit board and method for producing same

There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrateand a metal circuit plate (a copper plate) bonded to the ceramic substratethe metal circuit plate having a thickness which is more than 0.25 mm and which is less than 0.3 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 &#x3bc;m.

Metal/ceramic circuit board

After copper platesare bonded to both sides of a ceramic substratevia a brazing filler metal, UV curing alkali peeling type resistsare applied on predetermined portions of the surfaces of the copper platesto etch undesired portions of the copper platesto form a metal circuit portion. While the resistsare maintained, undesired portions of the brazing filler metaland a reaction product, which is produced by a reaction of the brazing filler metalwith the ceramic substrate, are removed (or undesired portions of the brazing filler metaland a reaction product, which is produced by a reaction of the brazing filler metalwith the ceramic substrate, are removed, and the side portion of the metal circuit portion is etched). Thereafter, the resistsare peeled off, and an Ni&#x2014;P electroless platingis carried out. Thus, in a method for producing a metal/ceramic bonding circuit board, it is possible to easily control the sectional shape of a metal/ceramic bonding circuit board by a smaller number of steps and at low costs, and it is possible to produce a metal/ceramic bonding circuit board which is more reliable with respect to thermal shock resistance and insulation performance.

Method for producing metal/ceramic bonding circuit board

There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plateof an alloy containing copper and nickel directly to at least one side of a ceramic substrate; applying a resiston a predetermined portion of the metal plateto remove an undesired portion of the metal plateby etching; and removing the resistto form a pattern having a predetermined shape of the alloy on the ceramic substrate. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.

There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate of an alloy containing copper and nickel directly to at least one side of a ceramic substrate ; applying a resist on a predetermined portion of the metal plate to remove an undesired portion of the metal plate by etching; and removing the resist to form a pattern having a predetermined shape of the alloy on the ceramic substrate . According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.

There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate and a metal circuit plate (a copper plate ) bonded to the ceramic substrate the metal circuit plate having a thickness of 0.1 mm to 0.5 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 &mgr;m.

There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 &mgr;m and which is 250 &mgr;m or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25% or more of the thickness of the metal plate.

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Nagano, Japan

Nobuyoshi Tsukaguchi