Sumitomo Electric Industries, Limited

Sumitomo Wiring Systems, Limited

Autonetworks Technologies, Limited

Nobuyoshi Tatoh

Shinya Nishina

Koji Nishi

Jun Yorita

Kenji Shinma

Kenichiro Shibata

Daisuke Takagi

Hiromi Iwamoto

Hiroshi Sudo

Takaaki Hirose

A grip portion is formed by a pair of half-split grip portions and grips an end portion of a tubular cable cover exteriorly mounted on a cable when the half-split grip portions are joined. A clamp portion is formed by a pair of half-split clamp portions and clamps the cable exposed from the end portion when the half-split clamp portions are joined. A clamp protrusion is formed on an inner surface of the clamp portion and clamps the cable exposed from the end portion by pressing the cable in a radial direction.

Joint for tubular cable cover

An optical semiconductor module having a large endothermic amount of an electronic cooling element can be provided, even if the area of the bottom plate of a package is the same. A packageincludes two or more units of electronic cooling elementmounted therein. Each unit of the electronic cooling element is inserted through the space between inner jutsof ceramic feedthrough of the packageand a bottom plate, and is fixed to the bottom plate. The plural units of electronic cooling element are connected in series by one or more copper piece. The total area of junction between the two or more units of electronic cooling element and the bottom plate area of the packageoccupies 75% or more of the area of the bottom plate. Thus, the ratio of the area of junction between the bottom plate and the electronic cooling element as a whole to the area of the bottom plate of the package can be increased.

Optical semiconductor module and method of producing the same

A circuit board comprising a first metal layer formed in patterns on a ceramic substrate, a second metal layer formed in patterns on the first metal layer, and a third metal layer formed covering the top surface of the second metal layer and the majority of the side surface, wherein the first and partial second metal layers not covered by the third metal layer are reduced in width by etching. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon.

Circuit board, method for manufacturing same, and high-output module

A hermetically sealing package for an optical semiconductor equipped with a light transmitting window whose light transmitting surface is inclined at least six degrees from the vertical line of the package bottom plate and which is joined to a cylindrical component on the package side wall by the use of a solder brazing material, in which the window material is made of a light-transmitting ceramic (such as alumina or spinel) plate in a substantially regular hexagonal or disk form in which a metallized portion is formed around the periphery, leaving a circular light transmitting portion in the center of the plate; and an optical semiconductor module that makes use of the package. The hermetically sealing package and the optical semiconductor module are easy and inexpensive to manufacture, have high reliability, and do not deform the plane of polarization.

Hermetically sealing package for optical semiconductor and optical semiconductor module

An optical semiconductor hermetic sealing package for accommodating an optical semiconductor element therein, comprising: a frame made of a metal, an insulator, or a composite of metal and insulator; a first bottom plate made of a metal fixed to the frame; a second bottom plate whose Young's modulus is larger than that of the first bottom plate and which is fixed to the surface of the first bottom plate on the opposite side to the frame; and a metal block plate that is fixed to the surface of flanges projecting on both sides of the first bottom plate, on the side of the second bottom plate. The optical semiconductor hermetic sealing package is capable of alleviating warping of the bottom plate and has an even more excellent heat radiating characteristic.

Optical semiconductor hermetic sealing package, optical semiconductor module and optical fiber amplifier

A hermetically sealing enclosure for housing photo-semiconductor devices that reduces the heat generated in the wiring strips at the ceramic terminal member, increases the allowable current of the wiring strips in comparison with the conventional enclosures while maintaining the low power consumption, and stabilizes the output of the device in the enclosure. A photo-semiconductor module incorporating the enclosure is also offered. The ceramic terminal member is provided with a first wiring layer that comprises a plurality of wiring strips and that penetrates through the ceramic terminal member; two second wiring layers each of which comprises at least one wiring strip, one of which is connected to the first wiring layer at the outside of the enclosure, and the other of which is connected to the first wiring layer at the inside; and at least one third wiring layer that comprises at least one wiring strip and that connects the two second wiring layers.

Hermetically sealing enclosure for housing photo-semiconductor devices and photo-semiconductor module incorporating the enclosure

A sealed airtight container wherein the width of the exposed electrode part provided in a ceramic terminal part is enlarged, and the exposed electrode part is connected to a wiring part and the width of the wiring part is equal to the enlarged width of the electrode part. A sealed airtight container for an optical-semiconductor with a small heat generation in the metallized wiring layer, small power consumption and large current carrying capacity, and an optical-semiconductor module with a stable optical output can be obtained.

Sealed airtight container for optical-semiconductors and optical-semiconductors module

Optical communication module having a constant plane of polarization of transmitted light

A method of manufacturing an optical semiconductor module, comprising joining an electronic cooling element to a bottom plate of an optical semiconductor package and mounting an optical semiconductor element on the electronic cooling element, wherein the electronic cooling element is soldered to the bottom plate of the optical semiconductor package in a hydrogen atmosphere. The soldering in a hydrogen atmosphere prevents oxidation of a low temperature solder provided on the uppermost surfaces of the electronic cooling element and conduction of the heat at the soldered joint portion between the electronic cooling element and the optical semiconductor element is improved.

Method of manufacturing an optical semiconductor module

An object of the present invention is to produce and provide a microbench for achieving a highspeed, low-cost semiconductor module having a high S/N ratio. A microbench for use in mounting an optical fiber, is characterized in that a substrate comprises a ceramics having a specific resistance 10 &OHgr;cm or larger and a dielectric constant of 15 or less, a groove for mounting an optical fiber is disposed on the surface thereof, a semiconductor device mounting portion onto which an optical semiconductor is mounted is provided at the end portion of this groove, and an alignment mark for semiconductor mounting is disposed in this semiconductor device mounting portion. The above-mentioned ceramics is either AlN, or a ceramics having AlN as its principal component.

Microbench and producing method therefor, and optical semiconductor module using same

A surface temperature sensor head including a first layer made of a material of a heat conductivity higher than 100 W/mK, a second layer having a crossing tips of a thermocouple and a brazing material and a third layer made of a material of a heat conductivity higher than 100 W/mK, the brazing material unifying the crossing tips, the first layer and the third layer. The sensor head enables a temperature prober to measure temperatures of an object non-destructively with high spatial resolution.

Surface temperature sensor head

A hermetically sealed optical-semiconductor container in which an optical-semiconductor element is accommodated, comprising a frame made of a metal, an insulating material or a composite material of a metal and an insulating material, a first bottom plate fixed to the frame, and a second bottom plate fixed to opposite surface of the first bottom plate to the frame, either of the first and second bottom plates being made of a metal and having a smaller Young's modulus than the other. For example, the first bottom plate is not less than 25&times;10 kg/mm in Young's modulus, and the second bottom plate is not greater than 15&times;10 kg/mm . An optical-semiconductor element, an electronic cooling device and the like are mounted in this container, thus producing an optical-semiconductor module free from degradation of an electronic cooling element nor deviation of an optical axis occurs.

Hermetically sealed optical-semiconductor container and optical-semiconductor module

A hermetically sealed optical-semiconductor container in which an optical-semiconductor element is accommodated, comprising a frame,made of a metal, an insulating material or a composite material of a metal and an insulating material, a first bottom plate,fixed to the frame, and a second bottom plate,fixed to opposite surface of the first bottom plate to the frame, either of the first and second bottom plates being made of a metal and having a smaller Young's modulus than the other. For example, the first bottom plate,is not less than 25&times;10,kg/mm,in Young's modulus, and the second bottom plate,is not greater than 15&times;10,kg/mm,. An optical-semiconductor element, an electronic cooling device and the like are mounted in this container, thus producing an optical-semiconductor module free from degradation of an electronic cooling element nor deviation of an optical axis occurs.

A package storing semiconductor devices and circuit boards with a cap having a plurality of conductive protrusions whose intervals are shorter than or equal to {c/(2v .epsilon..sup.1/2)}, where c is the light velocity, v is the maximum frequency of signals, and .epsilon. is the dielectric constant of the circuit boards. The protrusions attenuate the transmission of electromagnetic waves to reduce noise, cross-talk, parasitic oscillations, etc.

Semiconductor device package and semiconductor device module

A highly reliable air-tightly sealed container having a light transmissive window member formed of a borosilicate glass plate 4 and brazed to a cylindrical portion of a container side wall, the borosilicate glass plate being formed to a substantially right hexagonal shape and provided with a metallized portion 5 on an outer circumferential portion thereof with a circular light transmissive portion 6 left in the central part thereof, a diameter L.sub.1 of a circle inscribing the outer circumference of the borosilicate glass plate 4 and a diameter L.sub.2 of the light transmissive portion being in the relation of L.sub.2 /L.sub.1 .ltoreq.0.85. The thickness L.sub.3 of the borosilicate glass plate is 0.11-0.25 times as large as the diameter L.sub.1 mentioned above. The air-tightly sealed container uses a low-price borosilicate glass as the window member and free from the breakage of the borosilicate glass plate and the leakage of gas. A reliable photosemiconductor module can be obtained using the container.

Growing community of inventors

Itami, Japan

Nobuyoshi Tatoh