Toyo Tire Rubber Co., Ltd.

Nobuyoshi Ishizaka

Takeshi Fukuda

Masato Doura

Akinori Sato

A polishing pad having a polishing layer comprising a thermoset polyurethane foam, wherein the thermoset polyurethane foam contains, as raw material components, an isocyanate component, and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise one or more polyol compounds (each) having two or more functional groups, and a monool compound having one functional group.

Polishing pad, manufacturing method therefor, and method for manufacturing a semiconductor device

An object of the invention is to provide a polishing pad that achieves a high polishing rate and has high thickness precision so that the break-in time (dummy polishing time) can be shortened, and to provide a method for producing same. The invention is directed to a polishing pad including a base material layer and a polishing layer provided on the base material layer, wherein the polishing layer includes a thermoset polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 200 &#x3bc;m, and the polishing layer has a storage modulus E' (40&#xb0; C.) of 130 to 400 MPa at 40&#xb0; C., a ratio of storage modulus E&#x2032; (30&#xb0; C.) at 30&#xb0; C. to storage modulus E&#x2032; (60&#xb0; C.) at 60&#xb0; C. [E&#x2032;(30&#xb0; C.)/E&#x2032;(60&#xb0; C.)] of 1 to less than 2.5, and a ratio of storage modulus E&#x2032; (30&#xb0; C.) at 30&#xb0; C. to storage modulus E&#x2032; (90&#xb0; C.) at 90&#xb0; C. [E&#x2032;(30&#xb0; C.)/E&#x2032;(90&#xb0; C.)] of 15 to 130.

Polishing pad and method for producing same

A polishing pad having a polishing layer comprising a thermoset polyurethane foam,

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Osaka, Japan

Nobuyoshi Ishizaka