Taiyo Yuden Co., Ltd.

Taiyo Yuden Kabushiki Kaisha

Kogyo Gijutsuin

Nobuyasu Shiba

Hideyo Iida

Kazuhiko Otsuka

Takayuki Uehara

Hideo Aoba

Yoshihiro Amada

Nobuo Mamada

Nobuhiro Umeyama

Mizuho Imai

Mikio Sekiguchi

Iwao Fujikawa

Katsuo Koizumi

Toshio Mishuku

Hideyuki Karasawa

Hideki Ogawa

Yutaka Hayashi

Satoshi Kimura

Hidenori Aoki

Manabu Takayama

Kinya Iri

Takashi Tajima

Atsuo Itou

Mithuyuki Yamanaka

A wire wound electronic component of the present invention includes a bobbin having a core having a substantially circular cross-section and rectangular flanges formed at both ends of the core. A groove is formed in each side of each flange A conductive film or external electrode is formed on each flange A coil or wire is wound round the core and has a conductor protruding from opposite stripped ends thereof. The opposite ends of the conductor are respectively received in the grooves of the flanges and connected to the conductive films A coating or armor is formed on the coil and has a flat surface The coating has a rectangular configuration complementary to the configuration of the flanges

Method of manufacturing wire wound electronic component

A wire wound electronic component includes a bobbin having a core having a substantially circular cross-section and rectangular flanges formed at both ends of the core. A groove is formed in each side of each flange . A conductive film or external electrode is formed on each flange . A coil or wire is wound round the core and has a conductor protruding from opposite stripped ends thereof. The opposite ends of the conductor are respectively received in the grooves of the flanges and connected to the conductive films . A coating or armor is formed on the coil and has a flat surface . The coating has a rectangular configuration complementary to the configuration of the flanges

A common mode choke coil adapted for surface mount applications minimized in overall size (particularly in height), with an improved bonding coefficient. This common mode choke coil has a structure comprising a ferrite core consisting of a winding core and two square planar flanges with recesses formed therein, the square planar flanges being formed integrally on each end of a winding core thereof, a pair of external electrodes disposed on the square planar flanges, a plurality of windings wound about the winding core of the ferrite core and connected by thermal bonding to the external electrodes at the recesses provided in the left and right sides of each flange, and a ferrite plate adhesively bonded to the outermost surface of the windings to join the two flanges at both ends of the ferrite core, without an adhesive bonding to the flanges themselves. As a result, a closed magnetic circuit structure of a cubic component having a high rate of bonding coefficient is obtained.

Common mode choke coil

Wire wound electronic component

A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular figuration complementary to the configuration of the flanges 1b.

Wire wound electronic component and method of manufacturing the same

There is disclosed an atomized thin film forming apparatus for forming a thin film by spouting an atomized source solution toward a heated substrate. A pair of inner wall surfaces defined at the upper portion of a film forming nozzle and disposed opposite to each other with respect to the longitudinal direction of a film forming chamber are restricted so as to gradually narrow in the interval therebetween toward a spouting opening in a smooth curve. Hence, it is possible to prevent a mist of the source solution atomized by the atomizer from being locally stagnant in the film forming nozzle and prevent a precipitate of the atomized source solution from growing. Consequently, the flow of the mist of the source solution is not hindered by the precipitation of the atomized source solution so that the thin film is formed over the surface of the substrate at a high uniformity for a long period of time.

Atomized thin film forming apparatus

A thin film forming apparatus which forms a thin film over a surface of a subtrate by spraying a mist of a source solution produced by atomization over the surface of the substrate heated to a given temperature. The film forming apparatus is provided with a pair of guide members for supporting and guiding the substrate at opposite sides of the same. The distance between the opposite inner surfaces of the guide members can be changed according to the width of the substrate to be supported and guided by the pair of guide members. The distance between the respective lower portions of the opposite inner surfaces of the pair of guide members is greater than the distance between the upper portions of the opposite inner surfaces of the same, so that the distribution of the flow rate per unit flow passage area of the mist of the source solution is uniform with respect to the width of the substrate and enables a thin film of a uniform thickness to be formed over the entire surface of the substrate.

Thin film forming apparatus having adjustable guide

A thin film forming apparatus which forms a thin film over the film forming surface of a substrate by spraying a mist of a source solution produced by atomization over the film forming surface of the substrate heated to a given temperature. The substrate conveying direction is reversible, or a nozzle for spouting the mist into a film forming chamber and an exhaust duct are connected removably to a hearth forming the bottom wall of the film forming chamber and can be switched with one another. The film forming apparatus is capable of forming thin films of different laminate constructions.

Thin film forming apparatus

An amorphous silicon solar battery is formed by applying a sequence of layers on a transparent substrate, preferably of glass. A transparent electrode film of conductive material is applied on the substrate, followed by an amorphous silicon semi-conductor, which is in turn followed by a back electrode film of transparent conductive film. In addition, a metallic film may be formed on the back electrode. The surface roughness of the first transparent conductive film is such that the average grain diameter is in the range of 0.1-0.9 micron. Impinging light rays are refracted at random by this uneven surface. The result is an increase in the current density of the solar battery, due to the increased optical paths of the light rays through the semi-conductor material and the increased reflection effect at the second transparent conductive film.

Amorphous silicon solar battery

An amorphous semiconductor solar cell which comprises a glass substrate and a transparent electrode coated on the substrate. The device also comprises an amorphous semiconductor layer on the transparent electrode, and a rear electrode on the amorphous layer, wherein the average grain diameter of the surface of the transparent electrode ranges from 0.1 .mu.m to 2.5 .mu.m.

Growing community of inventors

Tokyo, Japan

Nobuyasu Shiba