Kabushiki Kaisha Shinkawa

Nobuto Yamazaki

Minoru Torihata

Yoshimitsu Terakado

Kuniyuki Takahashi

Shinji Maki

Tatsunari Mii

Akihiro Nishimura

Shinichi Kumazawa

Koichi Harada

Ryuichi Kyomasu

Hiroshi Ushiki

Kazuo Sugiura

Mitsuaki Sakakura

Yuji Ohashi

Shigeru Fuke

Minoru Kawagishi

Takayuki Iiyama

Koji Sato

Tooru Mochida

Hijiri Hayashi

Motohiko Kato

Yoshiyuki Ogata

Akihiro Hirayanagi

Kenji Kitakubo

Junkichi Enomoto

Takeshi Hasegawa

Tohru Mochida

Mitsuru Kagamihara

Kenji Katakubo

In a wire cutting and feeding device used in a wire bonding apparatus, piezo-electric actuators are used as the driving source of a slide block which moves wire clamper toward and away from a workpiece upon which bonding is performed. The piezo-electric actuators include a feeding piezo-electric actuator, which causes expansion and contraction of the slide block, and two clamping piezo-electric actuators, which are alternately operated and clamp the slide block. The slide block is caused to move by means of respective power-'on'/power-'off' combinations of the feeding piezo-electric actuator and the two clamping piezo-electric actuators.

Wire cutting and feeding device for use in wire bonding apparatus

A wire bonding method in the manufacture of, for instance, a semiconductor device in which first bonding points or pads of a chip and second bonding points or leads of a lead frame are connected by wires, and the bonding by wires is initiated from one end of the row of the first bonding points (pads) and is successively performed in one direction toward a center of the row, and after bonding has been performed up to an approximate center of the row, then bonding is initiated from another end of the row in the opposite direction toward the center of the row.

Wire bonding method

In a ball forming method used in manufacturing semiconductor devices, a ball is formed at the end of a bonding wire, this ball is pressed against an electrode of a semiconductor device and bonded to the electrode, a capillary is raised by a predetermined amount, and an ultrasonic vibration is applied to the capillary so that a portion of the wire located between the bonded ball and the lower end of the capillary is caused to undergo resonant vibration. This resonant vibration separates the wire from the bonding ball, thus leaving the ball on the electrode as a bump.

Bump forming method

A capillary for a wire bonding apparatus having a wire threading hole and a chamfer, in which the wire threading hole is formed in two stages as first and second wire threading holes, the diameter of the first wire threading hole which is located above the second wire threading hole exceeds the diameter of a bonding wire by no more than 3 to 8 microns, the diameter of the second wire threading hole is 5 to 10 microns greater than the first hole diameter, and the depth of the second wire threading hole is 10 to 50 microns.

Capillary for use in a wire bonding apparatus

In a capillary used in a wire bonding apparatus that has a wire threading hole through which a bonding wire of 10 to 30 .mu.m diameter passes and is provided with two chamfers, i.e., lower and upper chamfers, near the tip end of the wire threading hole, the upper chamfer has a chamfer angle of 3 to 19 degrees and a depth of 20 to 50 microns.

Capillary for a wire bonding apparatus

A method and apparatus for determining the position, size and/or shape of a ball formed on a pad of a semiconductor chip when a wire is bonded between the pad and a lead of a lead frame. The ball is detected in at least three directions from the center of the ball towards the edge of the ball.

Ball detection method and apparatus for wire-bonded parts

A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which is placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking air from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

Non-contact type moving table

A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

A bonding apparatus with an ultrasonic horn for manufacturing, for example, semiconductor devices having a horn support that is used for mounting the ultrasonic horn to a bonding arm of the bonding apparatus, and tow vibration-generating sources are provided on both sides of the horn support. The vibration-generating sources are such a piezoelectric element as an electrostrictive strain element and a magnetostrictor.

Bonding apparatus

In inspecting a bend of a wire which is bonded to, for example, a semiconductor device, a straight scale line with scale markings of constant intervals and a bonded-point line, both lines crossing each other at right angles, are shown on a monitor. An image of a wire that has a bend is monitored by a camera and displayed on a monitor. By overlapping the image of the bend of the wire on the scale line and then reading a scale marking which is closest to the bend of the wire, it is possible to ascertain the amount of the bend of the wire.

Method and apparatus for inspecting bent portions in wire loops

A non-contact type moving table system comprising a guide table and a moving table. The guide table and the moving table have air holes and vacuum holes on the surfaces facing each other, and compressed air is blown out of the air holes so that a space is created between the moving table and the guide tale, thus the moving table can move above the guide table without making contact with the guide table. In addition, vacuum suction is applied between the guide table and the moving table so that the moving table is stabilized on the guide table. Several modifications are obtained by combining pairs of the guide table and the moving table so that the moving table is moved in any desired horizontal direction. The non-contact type moving table can be simple in structure, compact in size, light in weight and is manufactured at low costs.

Non-contact type moving table system

A bonding apparatus including an ultrasonic horn that has a bonding tool, a horn support, which is for mounting the ultrasonic horn to a bonding arm of the bonding apparatus, and vibration-generating sources provided on both sides of the horn support. These vibration-generating sources are operated to generate vibrations by an ultrasonic oscillation device that operates the vibration-generating sources via separate outputs.

A pair of clamping arms of a wire clamper used in a wire bonding apparatus being opened and closed via the electric strain effect or magnetic strain effect of a piezoelectric element. With the use of a piezoelectric element that expands when energized to open the clamping arms so as to release the wire held by the clamping arms, the overall weight of the wire clamper can be small, a quick clamping action is secured and the clamping force which is easily adjustable can be steady at a set value.

Growing community of inventors

Tokyo, Japan

Nobuto Yamazaki