Kabushiki Kaisha Toshiba

Toshiba Infrastructure Systems & Solutions Corporation

Nobuto Fujiwara

Kenichi Ishikawa

Hiroshi Nakamura

Daisuke Hiratsuka

Akifumi Yamaguchi

Haruhiko Fujito

Yuuki Tsukinari

A semiconductor module according to embodiments includes a first external terminal, a second external terminal, a first semiconductor switch which is electrically connected between the first external terminal and the second external terminal and includes a first gate electrode, a second semiconductor switch which is electrically connected in parallel with the first semiconductor switch, between the first external terminal and the second external terminal, and includes a second gate electrode, a first fuse electrically connected between the first external terminal and the first semiconductor switch, and a second fuse electrically connected between the second external terminal and the first semiconductor switch.

Semiconductor module

According to one embodiment, an electronic apparatus includes a heating component, a housing, and a heat pipe. The housing accommodates the heating component and includes a wall. The wall includes a first region configured to receive heat from the component and a second region configured to have a lower temperature than a temperature of the first region. At least a portion of the heat pipe is buried in the wall from the first region to the second region.

Electronic apparatus

According to one embodiment, an electronic apparatus includes a heating component, a housing, and a heat diffusing member. The housing accommodates the heating component and includes a wall. The wall includes a first region configured to receive heat from the component and a second region configured to have a lower temperature than a temperature of the first region. The heat diffusing member is attached to an inner surface of the wall and extends from the first region to the second region.

According to one embodiment, an electronic apparatus includes a housing, a cooling fan in the housing including an intake and a discharge hole, and a wind shielding portion between the intake of the cooling fan and the discharge hole of the cooling fan. The wind shielding portion partitions at least partially an inner space of the housing.

Display device and electronic apparatus

According to one embodiment, an electronic apparatus is provided with a housing, a circuit board in the housing, fan blades configured to rotate and blow air in a centrifugal direction, and a casing which contains the fan blades. The casing includes an exhaust port and a cut portion which opens in a centrifugal direction different from a direction in which the exhaust port opens, from a perspective of a rotation center of the fan blades, and into which a part of the circuit board is inserted.

Electronic apparatus and cooling fan

According to one embodiment, an electronic apparatus includes an enclosure, printed wiring board, electronic component, fan, duct, fin assembly, and heat pipe. The enclosure has an exhaust port in a sidewall thereof. The electronic component is mounted on the printed wiring board. The fan is placed in the vicinity of the exhaust port. The duct guides an airflow generated by the fan to the exhaust port. The fin assembly constituted of a plurality of fins, is arranged between an exit of the duct and the exhaust port, and includes an extension portion. A part of the extension portion extends to a range configured to overhang the printed wiring board.

According to one embodiment, a centrifugal fan includes an impeller and a fan casing containing the impeller. An intake port configured to draw air and a first outlet port and a second outlet port configured to expel the air are provided in the fan casing. The first outlet port is open in a direction different from a direction in which the intake port is open. The second outlet port is open in a direction same as the direction in which the intake port is open in a position apart from the impeller.

Centrifugal fan and electronic apparatus

According to one embodiment, an electronic device includes a printed wiring board, a first heat generating part and a second heat generating part secured to one surface of the printed wiring board, a plurality of first heat pipes, a second heat pipe and a heat sink. The first heat pipes each include a first end portion, a second end portion on an opposite side to the first end portion and a middle portion located between the first and second end portions and thermally connected to the first heat generating part. The second heat pipe includes a third end portion connected to the second end portion and a fourth end portion provided on an opposite side to the third end portion and thermally connected to the second heat generating part. The second heat pipe has a width dimension larger than that of the first heat pipe.

Electronic device

An electronic device includes a cabinet, a first heat generating member, a second heat generating member, a fan unit, a first heat pipe and a second heat pipe. The first and second heat pipes are each formed by sealing an operation fluid which shifts its phase between gas and liquid into a pipe-like main body. In the second position, the first end portion of the first heat pipe is located at a position lower than that of the second end portion and the one end portion of the second heat pipe is located at a position higher than that of the other end portion. The second heat pipe includes a conveying mechanism that conveys the operation fluid in liquid phase from the other end portion to the one end portion.

According to one embodiment, an electronic apparatus is provided with a circuit board contained in a case and including a first surface and a second surface formed on the reverse side of the first surface, a first heat generating component mounted on the first surface, a second heat generating component mounted on the second surface, a radiator section located off the circuit board, a first heat transfer member extending along the first surface and provided between the first heat generating component and the radiator section, and a second heat transfer member extending along the second surface and provided between the second heat generating component and the radiator section.

According to one embodiment, an electronic apparatus is provided with a case, a printed circuit board which is contained in the case and includes a first surface and a second surface formed on the side opposite from the first surface, a first heating element mounted on the first surface, a second heating element mounted on the second surface, a first cooling fan used to cool the first heating element, and a second cooling fan used to cool the second heating element. A thickness of the second cooling fan is smaller than a thickness of the first cooling fan. The second cooling fan is mounted so as to overlap the first cooling fan in a direction parallel to the first surface of the circuit board and be situated within a range of the thickness of the first cooling fan.

A heat dissipating device includes a heat receiving unit having a heat receiving surface thermally connected to a heat generating object and a heat dissipating surface in an opposite to the receiving surface, a heat transferring unit mounted on the dissipating surface, transferring the heat received in the heat receiving surface, and diffusing the transferred heat to the dissipating surface, and a heat dissipating unit mounted on the dissipating surface and dissipating the diffused heat. An electronic apparatus includes a circuit board having an electronic part generating heat, a main body installing the circuit board, and the heat dissipating device described above.

Heat dissipating device and electronic apparatus including the same

A cooling unit comprises a heat sink arranged adjacent to a heat generating component, the heat sink having area dimensions greater than the heat generating component. A heat diffusing member is arranged between the heat generating component and the heat sink. A first heat conducting member is interposed between the heat generating component and the heat diffusing member, and a second heat conducting member is interposed between the heat diffusing member and the heat sink. The heat diffusing member has a thermal conductivity higher than the second heat conducting member and area dimensions greater than the heat generating component.

Growing community of inventors

Hamura, Japan

Nobuto Fujiwara