Admatechs Company Limited

Admatechs., Ltd.

Nobutaka Tomita

Yusuke Watanabe

Shinta Hagimoto

Yoshiaki Kato

Akihiko Suda

Tatsuo Fukano

Kimitoshi Sato

Yuki Arai

Masaru Kuraki

Osamu Nakano

Hiroyuki Onda

Kenta Takei

Kohei Ogata

Keisuke Kurita

An object of the present invention is to provide a composite oxide particle material formed of zinc molybdate having a high purity and a high circularity. The composite oxide particle material is formed of a composite oxide, of molybdenum and zinc, having an average particle diameter of 0.1 μm or more and 5.0 μm or less, a BET specific surface area of 1 m/g or more and 20 m/g or less, (peak intensity at 26.6° according to XRD)/(peak intensity at 24.2°) of 1.20 or more, an impurity concentration of 1 mass % or less, and a circularity of 0.90 or more. XRD is measured with CuKα radiation.

Composite oxide particle material, method for producing same, filler, filler-containing slurry composition, and filler-containing resin composition

A filler for electronic material according to the present invention has a silica particle material produced by a dry method, wherein D50 is 0.2 μm or greater and 7.0 μm or less. Further, in the filler for electronic material according to the present invention, (BET specific surface area)/(theoretical specific surface area calculated from D50) is 0.85 or greater and 1.2 or less (requirement 1), and/or D10/D50 is 0.55 or greater and 0.75 or less (requirement 2). When at least one of the requirements 1 and 2 is satisfied, electric characteristics such as a Df value are improved. Here, the BET specific surface area is a value measured by using nitrogen, and D50 is a 50 mass % cumulative diameter, i.e., a median diameter, and means a particle diameter at 50 mass % when the masses of particles are sequentially integrated from smaller particle diameters. Similarly, D10 is a 10 mass % cumulative diameter.

Filler for electronic materials and method for producing same, slurry for electronic materials, and resin composition for electronic materials

A particle material that has high dispersibility in a dispersion medium such as toluene having high hydrophobicity, and a slurry composition in which the particle material is used, are provided for solving the problem. A surface-modified particle material of the present invention includes: a particle material formed of an inorganic material; and a surface treatment agent formed of a silane compound having a first functional group that has any of C, N, and O atoms away over five or more atoms from Si to which an alkoxide is bound, the surface treatment agent allowing surface treatment of the particle material in such an amount that a degree of hydrophobicity becomes not less than 30%. Dispersibility is enhanced also in a dispersion medium having high hydrophobicity in a case where a functional group having a predetermined structure is introduced so as to impart predetermined or higher hydrophobicity.

Surface-modified particle material and slurry composition

A filler for resinous composition is contained and used in resinous composition, and includes: a crystalline siliceous particulate material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA and type MFI, and/or type MWW; and a surface treatment agent including an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material; the filler including the surface treatment agent in an amount falling in a range allowing the filler to exhibit a negative thermal expansion coefficient.

Filler for resinous composition, filler-containing slurry composition and filler-containing resinous composition

A filler for resinous composition is contained and used in resinous composition constituting electronic packaging material for electronic device, and includes: a filler ingredient including a crystalline siliceous material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA, type MFI and type CHA, and/or type MWW, wherein: the filler ingredient is free of any activity when evaluated by an 'NH3-TPD' method; and includes the crystalline siliceous material in an amount falling in a range allowing the filler ingredient to exhibit a negative thermal expansion coefficient. The filler ingredient may further be free of a surface in which silver, copper, zinc, mercury, tin, lead, bismuth, cadmium, chromium, cobalt and nickel are exposed.

Filler for resinous composition, filler-containing slurry composition and filler-containing resinous composition as well as production process for filler for resinous composition

A production method for an electronic material filler includes: a preparation step of preparing a silica particle material produced by a dry method; and a first surface treatment step of performing surface treatment on the silica particle material with a silane compound having a vinyl group, a phenyl group, a phenylamino group, an alkyl group having four or more carbon atoms, a methacryl group, or an epoxy group, to obtain a first surface treatment-processed particle material. After the silica particle material is produced by the dry method, the silica particle material is not brought into contact with liquid water, and has a particle diameter of 100 nm to 600 nm or a specific surface area of 5 m/g to 35 m/g.

Production method for electronic material filler and production method for electronic material resin composition

A particulate material with a composition expressed by MAlXin which 'M' includes one or more elements selected from the group consisting of Ti, V, Cr, Zr, Nb, Mo, Hf and Ta and 'X' includes C or one or more chemical structures selected from the group consisting of CN(where &#x201c;x&#x201d; is 0&#x3c;&#x201c;x&#x201d;&#x2264;1.0), wherein: &#x201c;a&#x201d; is two or three; &#x201c;b&#x201d; is more than 0.02; and &#x201c;c&#x201d; is from 0.8 to 1.2 when &#x201c;a&#x201d; is two; or &#x201c;c&#x201d; is from 1.8 to 2.6 when &#x201c;a&#x201d; is 3. The particulate material has thicknesses whose average value is from 3.5 nm or more to 20 nm or less, and sizes, [{(longer sides)+(shorter sides)}/2], whose average value is from 50 nm or more to 300 nm or less.

'MXene' particulate material, slurry, secondary battery, transparent electrode and production process for 'MXene' particulate material

A particulate material with a composition expressed by TiAl(CN)(where 'x' is more than 0.02, 'y' is 0&#x3c;&#x201c;y&#x201d;&#x3c;1.0, and &#x201c;z&#x201d; is from 0.8 to 1.20), the particulate material comprising layers including gap layers providing an interlayer distance of from 0.59 nm to 0.70 nm within a crystal lattice; and/or with another composition expressed by TiAl(CN)(where &#x201c;x&#x201d; is more than 0.02, &#x201c;y&#x201d; is 0&#x3c;&#x201c;y&#x201d;&#x3c;1.0, and &#x201c;z&#x201d; is from 1.80 to 2.60), the particulate material comprising layers including gap layers providing an interlayer distance of from 0.44 nm to 0.55 nm within a crystal lattice.

'MXene' particulate material, production process for the same and secondary battery

Electronic material filler, high-frequency substrate, and electronic material slurry

A composite material includes a resinous particulate material, and an inorganic particulate material having a particle diameter being smaller than that of the resinous particulate material, fused welded onto a surface of the resinous particulate material, formed of an inorganic oxide, and including OH groups generated by fuse welding in the surface. The composite particulate material exhibits a degree of sphericity of 0.8 or more, and a has volumetric average particle diameter of from 0.1 to 100 &#x3bc;m.

Composite particulate material and production process for the same, composite-particulate-material slurry, and resinous composition

A crystalline silica particulate material contains zinc (Zn) in an amount of 1 ppm or more, exhibits a volume average particle diameter of 200 &#x3bc;m or less, and is composed mainly of crystalline silica.

Crystalline silica particulate material and production process for the same as well as crystalline silica particulate material-containing slurry composition and crystalline silica particulate material-containing resinous composition

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Miyoshi, Japan

Nobutaka Tomita