Matsushita Electric Industrial Co., Ltd.

Nobutaka Abe

Yuji Nakamura

Yuzo Tsubouchi

Akira Nishimura

An electronic parts mounting method in which chips in a plurality of parts feeders are picked up respectively by at least three nozzles, and a lowered mounting efficiency is avoided when any of the nozzles becomes bad, thereby mounting the chips on a board with a good operation efficiency. In a normal condition, the chips in the parts feeders are simultaneously picked up respectively by the first, second and third nozzles, and are transferred to and mounted on the board. When any of the three nozzles becomes bad, the mounting of the chips by this bad nozzle is stopped while the mounting of the chips by the other normal nozzles is effected as scheduled in a program, and thereafter those chips scheduled to be mounted by the bad nozzle are mounted by the normal nozzles. Therefore, the number of the pick-up operations is reduced as much as possible, so that the mounting efficiency can be enhanced.

Method of and apparatus for mounting electronic parts

An electronic component mounting apparatus for determining whether or not a nozzle replacement operation is successfully performed. A horizontal array of nozzles are accommodated in the holder in a nozzle stocker, and a light emitting device and a light receiving device are arranged so that the light path between both runs above the nozzles. The nozzle stocker is arranged in a travel path of a feeding head. The nozzle mount of the feeding head returns a used nozzle into the holder or mounts a new nozzle thereon. When any nozzle remains lifted from the holder intercepting the light path, a returning operation of the used nozzle is determined to be a failure. When a nozzle replacement is performed, its success or failure is reliably determined by detecting a intercepting height of light and release height of light by the nozzle and nozzle mount, respectively.

Electronic component mounting apparatus and nozzle replacement method

There is disclosed an electronic parts mounting method in which it is possible to avoid a pick-up mistake for electronic parts (chips) in simultaneously picking up the chips respectively stored in juxtaposed parts feeders by a plurality of nozzles provided to a transfer head. Nozzle position data of first, second and third nozzles 9a, 9b and 9c are beforehand obtained by a first camera, and pick-up positions of the chips in parts feeders 4 are obtained by a second camera. After picking up respectively the chips in the parts feeders 4 by the nozzles 9a to 9c it is judged whether or not there would be caused the pick-up mistake. When it is judged there is caused no pick-up mistake, a transfer head is moved to a position above a board and each of the chips is mounted to the board. When it is judged there is caused any pick-up mistake, a pick-up mistake rate of any of the parts feeders in which the pick-up mistake occurs, is updated and each of the chips is picked up again by the nozzle which caused the pick-up mistake.

Method and apparatus for mounting parts with pick-up mistake detection

A first camera detects a positional relationship among first, second and third nozzles. A second camera detects pick-up positions of chips in parts feeders. Tolerance zones for the respective chips are determined, within which the nozzle can pick up the chip. When one of nozzles is placed in the corresponding pick-up position, it is judged whether or not other nozzles are located within the corresponding tolerance zones, respectively. If the judgment result is 'YES', the nozzles pick up the chips simultaneously , and if this result is 'NO', the nozzles pick up the chips separately.

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Dazaifu, Japan

Nobutaka Abe