Murata Manufacturing Co., Ltd.

Nobushige Araki

Hiroki Wakamatsu

Yuichi Maruyama

Hideki Shinkai

Masato Higuchi

An electrical contact component includes a base defining an external terminal to be mounted on a surface of a wiring board with a solder and a fitting portion having a substantially tubular shaped fitting periphery. The external terminal has a first principal surface opposing the surface of the wiring board, a second principal surface substantially parallel to the first principal surface, and sides substantially perpendicular to the first and second principal surfaces and connecting the first principal surface to the second principal surface. The fitting portion is continuously provided on the second principal surface. The fitting periphery of the fitting portion is electrically connected to the second principal surface and the sides of the external terminal by metal layers formed over their respective surfaces. The metal layer contains Ni as a principal constituent and Co, and the metal layer contains Au as a principal constituent.

Electrical contact component, coaxial connector, and electrical circuit device including the same

A surface acoustic wave element is mounted onto a mounting substrate having a terminal electrode via a bump by flip chip bonding. The surface acoustic wave element is covered with a resin film. The periphery of the surface acoustic wave element mounted on the mounting substrate is covered with a portion of the resin film so that the surface acoustic wave element is sealed. The resin film is hardened. Thus, a surface acoustic wave device is provided.

Method of producing piezoelectric component and piezoelectric component

A surface acoustic wave device includes a piezoelectric substrate and interdigital electrode portions disposed on the piezoelectric substrate. A functional film including at least one of a silicon nitride film, a silicon oxide film, and a silicon oxide nitride film is formed on the piezoelectric substrate having the interdigital electrode portions such that the functional film is formed on at least a portion of the interdigital electrode portions by an electron cyclotron resonance sputtering method.

Growing community of inventors

Kanazawa, Japan

Nobushige Araki