Canon Kabushiki Kaisha

Noburu Takakura

Shinichiro Koga

Hiroshi Tanaka

Masaaki Imaizumi

Shigeyuki Uzawa

Yoshio Kaneko

Akiya Nakai

Akihiko Kawamura

Satoru Jimbo

Kazuhiko Mishima

Takahiro Takiguchi

Kenji Yamamoto

Yoshio Suzaki

Yusuke Miura

Yoshihito Tada

The present invention provides a processing apparatus comprising: a generator configured to generate, based on image data of a measurement target, position information of the measurement target in a first direction; and a determinator configured to determine, based on a feature quantity of the image data related to a second direction different from the first direction, confidence of the position information of the measurement target generated by the generator.

Processing apparatus, measurement apparatus, lithography apparatus, method of manufacturing article, model, processing method, measurement method, generation method, and generation apparatus

A measurement apparatus measures position information of a measurement target in a first direction. The apparatus comprises a scope configured to capture an image of the measurement target and generate image data, and a processor configured to obtain, based on the image data, the position information of the measurement target in the first direction. The processor is configured to determines the position information of the measurement target in the first direction based on: provisional position information of the measurement target in the first direction obtained from the image data, and using a correction value which is output from a model by inputting, in the model, a feature quantity, of the image data, related to a second direction different from the first direction.

Measurement apparatus that measures position information of measurement target in predetermined direction

An information processing apparatus for acquiring an inspection condition for performing an inspection on a pattern formed by a lithography apparatus that forms a pattern on a substrate with an original includes an acquisition unit configured to acquire a second inspection condition to be applied in a case where an inspection is performed on a second pattern by inputting third information indicating a state of the lithography apparatus acquired when the second pattern is formed to a model, wherein the model is acquired by machine learning with learning data including first information indicating a state of the lithography apparatus acquired when a first pattern is formed and second information indicating a first inspection condition applied when an inspection is performed on the first pattern.

Information processing apparatus, storage medium, lithography apparatus, lithography system, and article manufacturing method

A method includes first step of forming first pattern in each of first region of a substrate by using scanning exposure apparatus, and second step of forming second pattern in each second region of the substrate having undergone the first step. Each second region includes at least two first regions, and in the first step, scanning direction in the scanning exposure apparatus is allocated to each of the at least two first regions. Combination of the scanning directions allocated to the at least two first regions is common to the second regions. The combination is determined such that the scanning directions of at least first regions, of the at least two first regions, which are arranged in a direction perpendicular to the scanning directions are alternately changed one by one.

Method of manufacturing pattern and article manufacturing method

The present invention provides an imprint apparatus comprising a plurality of processing devices configured to perform imprint processes for a plurality of substrates in parallel, and a controller configured to control the plurality of processing devices, wherein the controller is configured to control the plurality of processing devices so that each of the plurality of processing devices performs imprint processes for a plurality of regions whose positions correspond to each other over the plurality of substrates, and so that the plurality of processing devices respectively perform imprint processes for a plurality of regions whose positions are different from each other and which have shapes corresponding to each other in a single substrate.

Imprint apparatus, and method of manufacturing article

Provided is a lithography apparatus that has a plurality of processing units each of which configured to perform processing of pattern formation for substrates. The lithography apparatus also has a controller configured to manage the plurality of processing units as groups in accordance with characteristics of the pattern formation respectively, allocate the substrates included in one or more lots to one of the groups, and, if an unprocessed substrate allocated to the group still exist upon a standby state of a processing unit included in the group, allocate the unprocessed substrate to the processing unit in the standby state and then cause the processing units to perform parallel processing for the substrates based on the allocation.

Lithography apparatus, lithography method, lithography system, storage medium, and article manufacturing method

Provided is a lithography apparatus that includes a plurality of patterning devices each of which is configured to perform patterning for a substrate supplied from a preprocessing apparatus; and a controller configured to control the plurality of patterning devices such that a plurality of substrates respectively belonging to a plurality of lots is subjected to parallel processings by the plurality of patterning devices based on a plurality of recipe information respectively corresponding to the plurality of lots, and transmit information regarding a schedule of the parallel processings to the preprocessing apparatus.

An exposure apparatus sequentially transfers a pattern of an original to a plurality of shot regions on a substrate, wherein each shot region includes a chip region and a scribe line region surrounding the chip region. The apparatus includes a detector configured to detect light beams from a first mark and a second mark arranged in a first scribe line region and a second scribe line region, respectively, adjacent to each other on the substrate driven in a measurement scanning direction by substantially simultaneously observing the first scribe line region and the second scribe line region, and a processor configured to process detection signals output from the detector to determine positions of the first mark and the second mark, wherein the substrate is positioned based on the positions of the first mark and the second mark and is exposed.

Exposure apparatus, exposure method, and device manufacturing method

An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine of the corrected positional data. For sequential positioning of the regions on the wafer to the exposure position, the wafer movement is controlled on the basis of the prepared corrected positional data, whereby high-precision alignment of each region is assured.

Aligning method

An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine the corrected positional data. For sequential positioning of the regions on the wafer to the exposure position, the wafer movement is controlled on the basis of the prepared corrected positional data, whereby high-precision alignment of each region is assured.

An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine the corrected positional data.

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Utsunomiya, Japan

Noburu Takakura