Sumitomo Electric Industries, Limited

Osaka Diamond Industrial Co.

Nobuo Urakawa

Kazuwo Tsuji

Akito Yoshida

Shuichi Satoh

Yoshiaki Kumazawa

Katsuyuki Tanaka

Hitoshi Sumiya

Jun Sugawara

Akira Mizoguchi

Isao Ueoka

Akihiro Koike

Yukio Okanishi

Masaaki Yamanaka

Kosuke Mitsui

Tsutomu Takubo

Keiichi Satoh

Hideo Oshita

Hideki Ogawa

Hirotoshi Yoshinaga

Wire-saw and its manufacturing method

A synthetic single crystal diamond for wire drawing die; the process of manufacturing it and a wire drawing die to utilize it are disclosed. At least one plane of the diamond for wire drawing die is a cleavage plane of (111) faces, and the drawing hole of wire drawing die lies vertical to the cleavage plane. The diamond for the wire drawing die is produced by providing a synthetic single crystal having 20-400 ppm nitrogen of Ib type diamond. A groove is made on the diamond surface parallel to (111) faces employing energy beams such as a laser beam, an ion beam and an electron beam. A wedge is struck into the groove to cleave the diamond, and a plate is obtained. Furthermore, the plate is divided into polyhedrons, employing either an energy beam or a blade. The cleavage plane of the polyhedron is almost parallel to the (111) faces of crystal, therefore the cleavage plane is used as the standard plane to build the drawing hole.

Synthetic single crystal diamond for wiring drawing dies and process for

A blade comprises a disc-shaped substrate having a major surface and an outer peripheral edge portion encircling the major surface, and an abrasive grain layer mounted on the outer peripheral edge portion of the substrate. The substrate includes a first disc having a major surface, and a second disc having a major surface which is superposed on that of the first disc. The major surface of the second disc is separated from that of the first disc, thereby defining a clearance between the major surfaces of the first and second discs and correspondingly forming a convex surface region on the outside surface of the substrate. The peripheral portion of the convex surface region is provided with a contact portion where the major surfaces of the first and second discs are slidably in contact with each other. An adhesion inhibitor is applied to the major surfaces of the first and second discs before superposing these major surfaces with each other, and the outer peripheral edge portions of the superposed first and second discs are covered with a mixed powder of abrasive grains and metal powder. The mixed powder is then sintered, thereby forming the abrasive grain layer which is fixed to the outer peripheral edge portions. The first and second discs are then spot-welded together at a plurality of locations between the major surfaces of the first and second discs.

Abrasive blade with reduced cutting noise

Synthetic single crystal diamond for wire drawing dies

A diamond tool, e.g., cutting tool, dresser, wire drawing die, etc., having excellent wear resistance, heat resistance and oxidation resistance and with an improved tool life is provided, which is mainly composed of a synthetic diamond single crystal containing boron or boron and nitrogen.

Diamond tool

A tool comprising a blank and shank, bonded at a low temperature through a bonding layer of gold formed by thermocompression bonding between the blank and shank is provided which can be used at a high temperature independently of the temperature at which the blank and shank were bonded.

Tool using gold as a binder

A method for bonding a cubic boron nitride sintered compact to other cubic boron nitride sintered compact or to a body of shank material is disclosed. The method comprises forming a Ti layer of 0.01-1 .mu.m in thickness over a bonding interface between two cubic boron nitride sintered compacts or between a cubic boron nitride sintered compact and a body of shank material, forming a layer of Ni or Cu over the Ti layer to a thickness of 0.01-5 .mu.n, putting together the two cubic boron nitride sintered compacts or the cubic boron nitride sintered compact and the body of shank material with a 10-1,000 .mu.m foil of Al, Al-Ni alloy or Ag--Cu--In alloy being placed over the boding interface, and heating the cubic boron nitride sintered compact structure to temperatures above the meeting point of the metal foil and not exceeding 750.degree. C. in an inert atmosphere or in a vacuum.

Method for bonding a cubic boron nitride sintered compact

Growing community of inventors

Osaka, Japan

Nobuo Urakawa