Seiko Epson Corporation

Showa Denko K.k.

Showa Denko Kabushiki Kaisha

Nobuo Uotani

Hiroshi Takahashi

Tetsuya Aoyama

Kazuhiko Kitamura

Yuji Ito

Yasuhiro Oki

Takanori Kido

Yuji Itoh

Kyoichi Oka

Yoshihiro Saida

Haruo Yoshida

Toshio Koshikawa

Yoshitomo Shimazu

Kasumi Nakamura

Hitoshi Ota

Kiyohiko Takemoto

Seiji Mochizuki

Masahiro Ohmori

Takashi Ohkubo

Hidenori Nakamura

Katsura Ito

Yasunori Yamazaki

Kazuhiro Mitani

Kagetaka Ichikawa

Seiichi Tanabe

Masatoshi Murakami

Toshimasa Mori

Fumio Tsujino

Fumio Matsui

Noriko Murase

Takayuki Kamemura

Teruyuki Kobayashi

An ink composition, a recording medium or printed matter containing a compound expressed by General Formula 1The compound has a weight reduction after 1 hour at 60&#xb0;C. of no more than 1%. This makes it possible to provide the ink composition, a recording medium, printed matter, and an ink jet recording method wherein a light resistance of the printed matter is excellent, there is no ink clogging, and a high-quality image with almost no yellowing of the printed matter can be obtained.

Ink composition, recording medium, ink jet recording method, and printed matter

A titanium dioxide slurry for ink jet ink, which comprises water and surface-treated titanium dioxide particles dispersed in the water, the surface treatment being a treatment with an inorganic phosphoric acid compound. Also disclosed is an ink comprising the titanium dioxide slurry.

Ink jet white ink and titanium dioxide slurry therefor

A small-sized semiconductor light-emitting device of high emission directivity and high output is provided. A portion of a light extraction section of a semiconductor light-emitting device including a pn-junction portion is covered with a light-shielding substance of low conductivity. The electrical resistance of the light-shielding substance is 10&#x3a9;m or higher, and the substance contains powder of at least one species selected from metals and pigments. The powder of metal contains at least one species selected from among Al, Cu, Ag, Au, Pt, Ti, Ni, Sn, Pb, Mg, Zn, Fe, Co, and Cr. The powder is a plate-like powder having a thickness falling within a range of 0.001-10 &#x3bc;m and a length falling within a range of 0.01-100 &#x3bc;m.

Semiconductor light-emitting device

The present invention provides an LSI device polishing composition containing water, abrasive grains, an organic acid, and an oxidizing agent, and having a pH of 5.5-10.0 adjusted by an alkaline substance, the LSI device polishing composition being used for polishing a copper-containing metal wiring layer in which copper is deposited on an insulating film via barrier metal formed of Ta or TaN; and a method for producing LSI devices by use of the polishing composition. During polishing of a barrier metal such as Ta or TaN and a copper wiring layer, the rate of polishing Ta or TaN can be enhanced, to thereby prevent dishing and erosion.

LSI device polishing composition and method for producing LSI device

An ink composition and/or a recording medium are made to contain a compound expressed by general formula (1) and a hydrazide compound. An ink composition thereby obtained does not clog and the ink composition and recording medium thus obtained can offer high quality images that hardly cause yellowing of the resulting recording with superior light resistance. Recording and an inkjet recording method pertaining thereto are also provided. The compound of general formula (1) is:

Ink composition, recording medium, inkjet recording method, and recording

The ink composition of the present invention contains a coloring agent, water, a water-soluble organic solvent which is a liquid at least at temperatures of 40&deg; C. or less, and which has a solubility of 1 wt % or greater with respect to water at a temperature of 20&deg; C., and a saturation vapor pressure of 1.7 Pa or less at a temperature of 20&deg; C. (with said organic solvent being contained in the ink composition at the rate of 10 to 35 wt %), and one or more amidine type compounds. As a result, the present invention provides an ink composition, a recording medium, recorded matter and an ink jet recording method that make it possible to obtain images with a high image quality which are superior in terms of the gas resistance of the recorded matter.

Ink composition, ink jet recording method and recorded matter

Aqueous ink

Water resistance imparter, ink composition, reactive fluid, and method of ink-jet recording with two fluids

An additive for inkjet printing, comprising a stabilized ascorbic acid derivative. Also disclosed are a recording solution, a method for preventing discoloration and fading of an image, and a recording sheet, each using the additive. The color change of an image can be prevented by incorporating the stabilized ascorbic acid derivative into an inkjet-printed image.

Additive for inkjet printing, recording solution, method for preventing discoloration and fading of image, and recording sheet

A composition comprising metal oxide particles having photo-catalytic activity, a solvent-soluble zirconium compound and a solvent. Preferably, the metal oxide particles having photocatalytic activity are titanium oxide particles; the metal oxide particles have an average particle diameter of about 0.005 to 0.3 &mgr;m; and the amount of the zirconium compound is in the range of about 3-200 parts by weight, as ZrO , per 100 parts by weight of the metal oxide articles. A composite of a film having a photo-catalytic activity with a base material is made by coating the base material with the above composition to form a film, and curing the film on the base material.

Photocatalytic metal oxide composition, thin film, and composite

A polishing-material composition, for polishing of LSI devices, which is a polishing-material composition comprising water and cerium oxide which has been surface-treated with a coupling agent, wherein the maximum value is no greater than about 5 &mgr;m and the average value is about 0.01-1.0 &mgr;m in the secondary particle size distribution of the cerium oxide. Also, a polishing method for LSI devices which employs the polishing-material composition.

Polishing material composition and polishing method for polishing LSI devices

This invention relates to a polyorganosiloxane comprising a polymethylsilsesquioxane structure as a main structural unit and having a methyl group and a reactive group at the side chains thereof, which is suitable as a polymer modifier; a process for producing the same; a copolymer resin obtained by polymerizing the polyorganosiloxane with a polymerizable monomer or by reacting the polyorganosiloxane with a polymer; a method for crosslinking the copolymer resin; and a coating composition containing the copolymer resin.

Polyorganosiloxane and process for producing the same

A polymer having an isoindole structure represented by the following general formula: ##STR1##

Preparation of polymer having isoindole structures

Polymer having isoindole structure

Growing community of inventors

Chiba, Japan

Nobuo Uotani