Fujitsu Corporation

Nobuo Taketomi

Ryo Kanai

Kiyoyuki Hatanaka

Shigeo Iriguchi

Shigeru Sugino

Naoki Nakamura

Mitsunori Abe

Takahiro Kitagawa

Satoshi Watanabe

Takahide Mukoyama

Keiichi Yamamoto

Takashi Yoshida

Shunichi Kikuchi

Masaru Sugie

Yoshitaka Muraoka

Masahide Watanabe

A method of manufacturing a through hole of a substrate includes forming, to the substrate, a cutting hole surrounding a removal-target-part such that a connection part of the substrate remains, the connection part that connects the removal-target-part that is removed from the substrate and a remaining part other than the removal-target-part that has been removed, along a cutting line of the through hole formed to the substrate; applying plating on an area including an inner peripheral wall face of the cutting hole of the substrate; applying a film covering an opening of the cutting hole on a surface of the substrate applied with the plating and performing exposure and development of the film to form an etching resist covering an area including the opening of the cutting hole; performing etching of the plating applied on the substrate; removing the etching resist; and cutting the connection part to remove the removal-target-part.

Method of manufacturing through hole of substrate

A wiring board includes, a base plate that has a first surface, a second surface opposite to the first surface, and a side surface coupled to the first surface and the second surface, a conductor provided on the side surface, and a protrusion provided over the side surface. The protrusion partitions the conductor into a first portion on the side surface that extends to the first surface and a second portion on the side surface that extends to the second surface. The protrusion has a solder wettability lower than the conductor and protrudes from the conductor.

Wiring board, electronic apparatus, method for attaching sheet metal covers, and method for manufacturing wiring board

A printed wiring board includes: a laminated body that has a plurality of wiring layers laminated therein; a first through hole that electrically connects two or more wiring layers with each other; and a second through hole that has strength to expansion and contraction of the laminated body less than in the first through hole.

Printed wiring board, crack prediction device, and crack prediction method

A substrate includes an insulation layer including a glass cloth impregnated with a resin, and a through hole having a hole included in the insulation layer and plating formed in an inner surface of the hole, where a location, intersecting with the glass cloth, of an outer circumferential portion of the through hole has a recessed portion recessed toward an outside of the hole.

Substrate and method of manufacturing the same

Disclosed substrate with embedded component includes: an insulating base member; a conductive pad formed on the insulating base member; a component connected to the conductive pad with a solder; and a resin covering the component, wherein a hole is provided in the insulating base member and the conductive pad, and the insulating base member is exposed on a side surface of the hole.

Substrate with embedded component

A flexible printed board includes a base material, first conductive pads arranged along an imaginary line on the base material and extending with a first width from front end to rear end on a front side of the imaginary line, second conductive pads arranged along the imaginary line and extending with a second width from front end on a rear side of the imaginary line to rear end, first wiring patterns provided between the second conductive pads, and extending with a third width to front end connected to the rear ends of the first conductive pads, and a reinforcing layer for reinforcing a reinforcing area over the first conductive pads and the first wiring patterns, and having a front edge on a front side of rear ends of the first conductive pads and a rear edge on a rear side of the rear ends of the second conductive pads.

Flexible printed board

A repair system which prevents heating of weakly heat resistant devices together and causing deterioration of the quality when preheating a first surface of the circuit board, wherein an electromagnetic induction material is buried in advance inside the circuit board near a specific electronic device envisioned as needed repair when becoming a defective electronic device in a production process and an electromagnetic coil emitting electromagnetic waves to an electromagnetic induction member in the vicinity of the repair device is provided and the heat generated by the electromagnetic induction member due to the electromagnetic waves enables the repair device to be heated and detached from the circuit board.

Method of repair of electronic device and repair system

A flexible printed circuit board that electrically connects a main body and a rotary body to each other is twisted in advance through an angle that is a half of an angle of rotation through which the rotary body is rotated. One end of the flexible printed circuit board is fixed to the main body, and the other end thereof is fixed to the rotary body. The rotary body is rotated in a direction causing the twist of the flexible printed circuit board to diminish.

Electronic apparatus

A printed circuit board is provided with a plurality of insulator layers and a plurality of conductor layers, and an outermost conductor layer has a plurality of foot patterns in outer and inner rows for mounting a BGA component and signal patterns. The width of at least a part of the signal pattern extending from the foot pattern in the outer row is greater than the width of the signal pattern extending from the foot pattern in the inner row. The printed circuit board further includes a protection layer for covering the signal patterns on the outermost conductor layer, and the protection layer has openings each for permitting the foot pattern to be exposed. At least a portion of the signal pattern appearing in the opening is widened.

Growing community of inventors

Kodaira, Japan

Nobuo Taketomi