Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Nobuo Sashinaka

Kazunari Nishihara

Takashi Kubo

Tetsuya Tsurunari

Naoki Yuda

Naoto Onodera

Toshinari Noda

Hiroki Kamiguchi

Shoichi Taji

Ryosuke Meshii

Naoki Ota

Naoki Takehata

An infrared ray detecting element includes: a substrate having a cavity; an infrared ray detecting portion including, sequentially stacked, a lower electrode layer, a detection layer, and an upper electrode layer; first and second support portions which support the infrared ray detecting portion above the cavity; and first and second external lead portions for leading electrical signals outputted from the infrared ray detecting portion, to the outside. The first support portion includes, sequentially stacked, a first upper wiring pattern, a first insulating layer, and a first lower wiring pattern. The upper electrode layer is connected to the first external lead portion via the first upper wiring pattern. The second support portion includes, sequentially stacked, a second upper wiring pattern, a second insulating layer, and a second lower wiring pattern. The lower electrode layer is connected to the second external lead portion via the second lower wiring pattern.

Infrared ray detecting element and infrared ray detector including the same

A substrate on which cavities having floors and steps is provided. End faces of a light-emitting device, an optical component, and an optical transmission line are abutted on one of the cavity for positioning, and end faces of a light-receiving device, an optical component, and an optical transmission line are also abutted on the other cavity for positioning. Integrated alignment of optical axes facilitates alignment of optical axes, and thus eliminates the need of a CAN package. Accordingly, the size and height of an optical communications module can be reduced.

Optical communications module and substrate for the same

An optical component is provided for optical communication and has a smaller size and a shorter height. The optical component involves a concave package provided by layering ceramic substrates, a groove section formed at a bottom face of this package, an optical semiconductor element provided in this groove section, a cover provided to cover an opening section of the package and a lens formed at the cover.

Optical component and method of manufacturing the same

Growing community of inventors

Osaka, Japan

Nobuo Sashinaka