Mitsui High-tec Incorporated

Nobuo Sakai

Migaku Ishida

Junichi Irie

A spherical body grinding and polishing apparatus comprises: a rotary shaft having a spiral path groove in the outer cylindrical surface along which spherical bodies to be processed are moved, the rotary shaft being vertically movable and rotatable; and a housing having grinding and polishing surfaces on which the spherical surfaces of the spherical bodies moving along the path groove are slid. When spherical bodies such as silicon spherical bodies are supplied to the apparatus, the spherical bodies are rolled and moved along the spiral path groove formed in the outer cylindrical surface of the rotary shaft while sliding on the inner surface of the housing, so that the outer surfaces of the spherical bodies are ground and polished until the spherical bodies become high in sphericity.

Apparatus and method for grinding and polishing spherical bodies

It is an object of the present invention to provide a novel carrying apparatus for carrying spherical objects such as spherical semiconductors of silicon in which the spherical objects are not contacted with an inner surface of a pipe-shaped body while they are being carried in the pipe-shaped body. The carrying apparatus for carrying spherical objects is provided with a spiral current generating means for generating a spiral current of fluid, and the spiral current generated by the spiral current generating means is introduced into a passage of the spherical objects. The spiral current generating means includes a rotary shaft 3 in which a carrying passage 2 is formed in a direction of the central axis and a spiral groove 3b is formed at a predetermined position on the outer circumferential surface. Further, in the rotary shaft 3, a jet pipe 3a connecting the carrying passage 2 with the spiral groove 3b is formed.

Carrying apparatus for spherical objects

A apparatus for carrying spherical objects is adopted, which comprises: a housing 1; a cylindrical rotor 6 arranged in the housing, including a plurality of recess grooves 11 which are open to the outer circumferential surface, the plurality of recess grooves being arranged radially from the center of the rotor 6; a guide ring arranged in the housing, the guide ring 3 including an inner hole 5, the section of which is elliptical, in which the cylindrical rotor 6 is accommodated; a vane 12 slidably arranged in each recess groove 11; a first carrier atmosphere feeding pipe 16 connected with a converting section of the guide ring 3 in which the inner hole 5 is changed from a small diameter section to a large diameter section; a first carrier atmosphere discharging pipe 17 connected with a converting section of the guide ring 3 in which the inner hole 5 is changed from a large diameter section to a small diameter section; a second carrier atmosphere feeding pipe 18 connected with a converting section of the guide ring 3 in which the inner hole 5 is changed from a small diameter section to a large diameter section; and a second carrier atmosphere discharging pipe 19 connected with a converting section of the guide ring 3 in which the inner hole 5 is changed from a large diameter section to a small diameter section.

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Fukuoka, Japan

Nobuo Sakai