Fujitsu Corporation

Fujitsu Semiconductor Limited

Nobuo Ooyama

Kazuto Tsuji

Yukio Saigo

Kenji Itasaka

Terumi Kamifukumoto

Fumitoshi Fujisaki

Shinichiro Maki

Yuji Akasaki

Yasuo Yatsuda

Masafumi Tetaka

Syunichi Kuramoto

Youichi Matae

Atsushi Yano

A method of testing semiconductor devices includes an adhering step, a position correcting step, and an electrical test step. The adhering step includes adhering either a semiconductor device collective body or a plurality of individual semiconductor devices onto an adhesive tape provided on a tape-holding member, the semiconductor device collective body being constructed by a plurality of semiconductor devices integrated together. The position correcting step includes positioning the semiconductor devices by mounting the tape-holding member on a position correction unit and, using an image processing technique, implementing position recognition and position correction of the semiconductor devices adhered on the adhesive tape. The electrical test step includes implementing an electrical characteristic test on the semiconductor devices positioned in the position correction step by connected the semiconductor devices on a testing contactor.

Method and apparatus for testing semiconductor devices

A semiconductor device and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip; a resin package which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; a grounding metal film in contact with the bottom surface of the semiconductor chip; and a grounding passage which is connected to the grounding metal film and guided outward from the resin package.

Semiconductor device and method of producing the same

Growing community of inventors

Kagoshima, Japan

Nobuo Ooyama