Kyoto Elex Co., Ltd.

Nobuo Ochiai

Masashi Nakayama

Takashi Hinotsu

Yutaka Nakayama

Masami Sakuraba

Wataru Fujimori

Seiichi Nakatani

Kazuya Takagi

Kenichi Harigae

Kairi Otani

Nozomu Hayashida

Disclosed herein is a conductive paste for forming a conductive film, including: (A) a conductive powder; (B) as a first additive, at least one selected from a first group consisting of Se, Te, a compound containing Se, and a compound containing Te; (C) as a second additive, a compound containing at least one element selected from a second group consisting of V, Nb, Ta, Sb, Bi, Mn, Ge, Si, and W; (D) glass frit; (E) an organic binder; and (F) a solvent.

Conductive paste for forming conductive film for semiconductor devices, semiconductor device, and method for producing semiconductor device

In order to provide an electro-conductive paste bringing no increase of the contact resistance for forming an electrode of a solar cell device, the electro-conductive paste is characterized by containing an electro-conductive particle, an organic binder, a solvent, a glass frit, and an organic compound including alkaline earth metal, a metal with a low melting point or a compound affiliated with a metal with a low melting point.

Electro-conductive paste for forming an electrode of a solar cell device, a solar cell device and method for producing the solar cell device

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Nagaokakyo, Japan

Nobuo Ochiai