Taiyo Yuden Kabushiki Kaisha

Taiyo Yuden Co., Ltd.

Taiyo Yuden Kabushiki Kaishi

Nobuo Mamada

Hiroyuki Masuda

Kenichiro Nogi

Kinya Iri

Kazuhiko Otsuka

Takayuki Uehara

Nobuyasu Shiba

Nobuhiro Umeyama

Hideo Aoba

Iwao Fujikawa

Katsuo Koizumi

Yoshihiro Amada

Satoru Sekiguchi

Masataka Kohara

A circuit board having coupled multilayered ceramic capacitors mounted thereon considerably reduces the generation of sounds developed by piezoelectric effects in the capacitors. A method for mounting the capacitors on the circuit board includes the step of forming lands for mounting the capacitors thereon at substantially plane-symmetrical positions on the front surface and the back surface of the circuit board, two lands at their substantially plane-symmetrical positions being connected each other. The capacitors, which are substantially identical each other, are then mounted on the lands of the front and the back surfaces such that the capacitors are disposed at substantially plane-symmetrical positions and electrically coupled to the lands. As a result, vibrations being transferred from the capacitors to the circuit board are cancelled out with each other and the resonance of the circuit board due to the vibrations from the capacitors is prevented, resulting in the generation of audible sounds with high sound pressure levels being considerably reduced compared to that of the prior art.

Circuit board having thereon coupled ceramic capacitors and method for the manufacture thereof

A chip inductor is made up of a coiled conducting wire and a magnetic member which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic member. External electrodes are formed with conducting thin films and are connected to respective end portions of the coiled conducting wire. An inorganic material is interposed in a clearance between winds of both end portions of the conducting wire and external surfaces of the magnetic member and a clearance between adjoining winds of the conducting wire.

Chip inductor, chip inductor array and method of manufacturing same

A wire wound electronic component of the present invention includes a bobbin having a core having a substantially circular cross-section and rectangular flanges formed at both ends of the core. A groove is formed in each side of each flange A conductive film or external electrode is formed on each flange A coil or wire is wound round the core and has a conductor protruding from opposite stripped ends thereof. The opposite ends of the conductor are respectively received in the grooves of the flanges and connected to the conductive films A coating or armor is formed on the coil and has a flat surface The coating has a rectangular configuration complementary to the configuration of the flanges

Method of manufacturing wire wound electronic component

A wire wound electronic component includes a bobbin having a core having a substantially circular cross-section and rectangular flanges formed at both ends of the core. A groove is formed in each side of each flange . A conductive film or external electrode is formed on each flange . A coil or wire is wound round the core and has a conductor protruding from opposite stripped ends thereof. The opposite ends of the conductor are respectively received in the grooves of the flanges and connected to the conductive films . A coating or armor is formed on the coil and has a flat surface . The coating has a rectangular configuration complementary to the configuration of the flanges

Method of manufacturing a chip inductor

Method of manufacturing chip inductors and chip inductor arrays

A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular figuration complementary to the configuration of the flanges 1b.

Wire wound electronic component and method of manufacturing the same

A chip inductor has a magnetic member which is formed by sintering and a coiled conducting wire which is embedded in the magnetic member. The magnetic member has a clearance in each axial end portion thereof such that each terminal end portion of the coiled conducting wire is exposed to an outside of the magnetic member in a linear configuration. An external electrode is formed on each end portion of the magnetic member such that the external electrode penetrates into the clearance into contact with the terminal end portions of the coiled conducting wire.

A winding core is formed by extruding a kneaded material to be obtained by kneading a powdered magnetic material and a binder. A plurality of bundled conducting wires are wound around the winding core into a coiled shape. An external cover element is formed by extruding the kneaded material to enclose the plurality of conducting wires. The winding core and the external cover element are sintered such that the plurality of bundled conducting wires wound around the core into a coiled shape are deformed into a zigzag manner by the stress due to shrinkage of the external cover element at the time of sintering thereof. The partially manufactured product obtained by the preceding steps, is cut into a predetermined length to thereby obtain a plurality of chip inductor main bodies. An external electrode is formed on each of end surfaces of the respective chip inductor main bodies. The external electrode is connected to each end portion of the conducting wires. Each end portion of the conducting wires is exposed to each of the end surfaces of the respective chip inductor main bodies.

Chip inductor

A winding core is formed by extruding a kneaded material to be obtained by kneading a powdered magnetic material and a binder. A plurality of bundled conducting wires are wound around the winding core into a coiled shape. An external cover element is formed by extruding the kneaded material to enclose the plurality of conducting wires. The winding core and the external cover element are sintered such that the plurality of bundled conducting wires wound around the core into a coiled shape are deformed into a zigzag manner by the stress due to shrinkage of the external cover element at the time of sintering thereof. The partially manufactured product, obtained by the preceding steps, is cut into a predetermined length to thereby obtain a plurality of chip inductor main bodies. An external electrode is formed on each of end surfaces of the respective chip inductor main bodies. The external electrode is connected to each end portion of the conducting wires. Each end portion of the conducting wires is exposed to each of the end surfaces of the respective chip inductor main bodies.

Growing community of inventors

Tokyo, Japan

Nobuo Mamada