Panasonic Intellectual Property Management Co., Ltd.

Nobuo Komiya

Katsuhiko Itoh

Masayuki Mantani

An electronic component mounting system includes: a printing apparatus; a plurality of electronic component mounting apparatuses; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic component mounting apparatuses. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for each of the electronic component mounting apparatuses by referring to the mounting information.

Electronic component mounting system and electronic component mounting method

A screen printing system includes a first substrate supply apparatus, a second substrate supply apparatus arranged in an upstream process side of the first substrate supply apparatus, and a screen printing apparatus that prints paste on a first substrate supplied from the first substrate supply apparatus and a second substrate supplied from the second substrate supply apparatus. In response to a request from the screen printing apparatus, the first substrate supply part supplies the first substrate and the second substrate supply part supplies the second substrate. The second substrate is carried in the screen printing apparatus by a conveyance mechanism included in the first substrate supply apparatus.

Screen printing system, screen printing apparatus and component mounting line

An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information&#x2014;when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of a printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component mounting device.

Growing community of inventors

Yamanashi, Japan

Nobuo Komiya