Other

Fujitsu Corporation

Nobuo Hirasawa

Osamu Ikata

Yoshio Satoh

Hidenori Fukushima

Masanori Ueda

Yasuhide Iwamoto

Hiroaki Toshima

Hideki Ohmori

Kazushi Hashimoto

Toshio Matsuzaki

A duplexer device of this invention includes two surface acoustic wave filters having different band center frequencies and a phase matching circuit for matching phases of the two surface acoustic wave filters. The phase matching circuit is composed of one or more. line patterns, and at least one of the line patterns is formed as divided among a plurality of internal layers of a multi-layer package, and at least the line patterns formed on the internal layers adjacent to each other have pattern shapes different from each other. According to the invention, a duplexer device having a small size and stable filter characteristics can be provided.

Duplexer device

This invention is a duplexer device comprising two surface acoustic wave filters having band center frequencies different from each other and a line pattern for matching phases of the two surface acoustic Wave filters, wherein provided are: a wire bonding pad layer having a plurality of pads including. pads. for connecting the line pattern with terminals on the surface acoustic wave filters and pads for connecting a common terminal connected to. an external antenna with the line pattern; and a first pad connecting one of the surface acoustic wave filters and a first end of the line pattern and a second pad connecting the common terminal and a second end of the line pattern being arranged at positions that are the most distant from each other inside the wire bonding pad layer.

Saw filter duplexer device with optimal location of a phase matching line pattern and wire bonding pads

In a duplexer, phase matching circuit patterns corresponding to filter chips are formed on a surface layer of a multi-layer ceramic package provided with filter chips having different central frequencies. An end of each of the phase matching circuit patterns is connected to a common terminal pattern.

Surface acoustic wave filter duplexer comprising a multi-layer package

A multilayer duplexer package is provided, which includes: two surface-acoustic-wave filter chips having different center pass band frequencies; and at least two phase matching circuits for matching the phase of one filter chip to that of the other filter chip, said phase matching circuits respectively comprising strip lines stacked one above another, and said strip lines each having a characteristic impedance higher than the characteristic impedance of an external circuit to be connected to the duplexer package.

Duplexer package

A hybrid integrated circuit is provided having a substrate with at least one active and passive element disposed thereon. A lead frame has a plurality of leads and a support plate. The support plate supports the substrate. The support plate and inner leads are encapsulated in a resin mold package. An opening is formed in the support plate to thermally connect the bottom surface of the substrate to the resin mold package, and a plurality of devoid portions are formed in the substrate causing the amount of edge area contacting the resin mold package to be increased and adhesion between the substrate and the resin mold package improved.

Resin mold package structure of integrated circuit

A filter device for filtering hydrocarbon fuel, such as gasoline, includes a filter device having a ceramic material which can activate water. The hydrocarbon fuel which is passed through the ceramic material can be activated by the ceramic material. The ceramic material may comprise ceramic particles housed in the filter body, or a powdery ceramic material attached to the filter body, which comprises an elastic network body having interconnected spaces communicating with each other.

Growing community of inventors

Kawasaki, Japan

Nobuo Hirasawa