Disco Corporation

Disco Corportation

Nobumori Ogoshi

Masaru Nakamura

Keiji Nomaru

Satoshi Kobayashi

Yosuke Watanabe

Kohei Matsumoto

Shunsuke Teranishi

Atsushi Ueki

Shigefumi Okada

Yuriko Sato

Yasuhiro Shimma

Koichi Mitani

Taizo Kise

Tatsuya Inaoka

Disclosed herein is a using method for a test wafer including a test substrate and a metal foil formed on the front side of the test substrate. The using method includes a modified layer forming step of applying a laser beam having a transmission wavelength to the test substrate from the back side of the test wafer in the condition where the focal point of the laser beam is set inside the test substrate, thereby forming a modified layer inside the test substrate, and a damage detecting step of observing the front side of the test wafer after performing the modified layer forming step, thereby detecting damage to the metal foil.

Method for using a test wafer by forming modified layer using a laser beam and observing damage after forming modified layer

During the performance of a laser processing step of applying a laser beam to a wafer to form modified layers inside the wafer respectively along division lines, a predetermined one of the modified layers already formed is imaged by a camera from the back side of the wafer with predetermined timing, and a positional deviation of the predetermined modified layer from the corresponding division line is detected to calculate a correction value. Then, the correction value is added to data on applied position of the laser beam to thereby make the applied position of the laser beam coincide with each division line. Accordingly, a positional deviation of the modified layer to be formed after this correction from each division line can be suppressed.

Laser processing method for workpiece

A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step for putting the wafer on the surface of an adhesive tape mounted on an annular frame; a wafer cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame; and a diving step for dividing the wafer along the dividing lines by expanding the adhesive tape to which the cooled wafer is affixed.

Wafer dividing method and wafer dividing apparatus

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Tokyo, Japan

Nobumori Ogoshi